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name:-0.0055768489837646
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Lih Duo International Co., Ltd. Patent Filings

Lih Duo International Co., Ltd.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Lih Duo International Co., Ltd..The latest application filed is for "memory module with rubber spring connector".

Company Profile
0.2.6
  • Lih Duo International Co., Ltd. - Taipei County TW
  • Lih Duo International Co., Ltd. - Wu Gu Shiang TW 248
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Memory module
Grant 7,323,775 - Wang January 29, 2
2008-01-29
Memory module with rubber spring connector
App 20070181999 - Wang; Sung-Lai
2007-08-09
VGA interface card
App 20070159802 - Wang; Sung-Lai
2007-07-12
Rubber spring connector
App 20070161265 - Wang; Sung-Lai
2007-07-12
IC embedding seat
Grant 7,232,318 - Wang June 19, 2
2007-06-19
Memory module
App 20070114660 - Wang; Sung-Lai
2007-05-24
Ic Embedding Seat
App 20070117425 - Wang; Sung-Lai
2007-05-24
Printed circuit board and memory module using the same
App 20070064401 - Chiang; Johnson
2007-03-22

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