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Patent applications and USPTO patent grants for Lih Duo International Co., Ltd..The latest application filed is for "memory module with rubber spring connector".
Patent | Date |
---|---|
Memory module Grant 7,323,775 - Wang January 29, 2 | 2008-01-29 |
Memory module with rubber spring connector App 20070181999 - Wang; Sung-Lai | 2007-08-09 |
VGA interface card App 20070159802 - Wang; Sung-Lai | 2007-07-12 |
Rubber spring connector App 20070161265 - Wang; Sung-Lai | 2007-07-12 |
IC embedding seat Grant 7,232,318 - Wang June 19, 2 | 2007-06-19 |
Memory module App 20070114660 - Wang; Sung-Lai | 2007-05-24 |
Ic Embedding Seat App 20070117425 - Wang; Sung-Lai | 2007-05-24 |
Printed circuit board and memory module using the same App 20070064401 - Chiang; Johnson | 2007-03-22 |
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