Lifson; Max L.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Lifson; Max L..The latest application filed is for "3d printing of metal containing structures".
- Lifson; Max L. - Pasadena CA
- Lifson; Max L. - South Burlington VT
- Lifson; Max L. - S. Burlington VT
- Lifson; Max L. - Burlington VT
| Patent | Date |
|---|---|
| 3D printing of metal containing structures Grant 11,318,435 - Yee , et al. May 3, 2 | 2022-05-03 |
| Integrated circuit heat dissipation using nanostructures Grant 11,152,495 - Botula , et al. October 19, 2 | 2021-10-19 |
| Integrated circuit heat dissipation using nanostructures Grant 11,081,572 - Botula , et al. August 3, 2 | 2021-08-03 |
| 3d Printing Of Metal Containing Structures App 20200156035 - YEE; Daryl Wei Liang ; et al. | 2020-05-21 |
| Integrated circuit heat dissipation using nanostructures Grant 10,629,710 - Botula , et al. | 2020-04-21 |
| Integrated circuit heat dissipation using nanostructures Grant 10,600,893 - Botula , et al. | 2020-03-24 |
| Integrated Circuit Heat Dissipation Using Nanostructures App 20200027973 - BOTULA; Alan B. ; et al. | 2020-01-23 |
| Integrated Circuit Heat Dissipation Using Nanostructures App 20190363182 - BOTULA; Alan B. ; et al. | 2019-11-28 |
| Centering substrates on a chuck Grant 10,224,225 - Adderly , et al. | 2019-03-05 |
| Integrated Circuit Heat Dissipation Using Nanostructures App 20180331207 - BOTULA; Alan B. ; et al. | 2018-11-15 |
| Integrated circuit heat dissipation using nanostructures Grant 10,109,553 - Botula , et al. October 23, 2 | 2018-10-23 |
| Integrated Circuit Heat Dissipation Using Nanostructures App 20180294346 - BOTULA; Alan B. ; et al. | 2018-10-11 |
| Integrated circuit heat dissipation using nanostructures Grant 10,068,827 - Botula , et al. September 4, 2 | 2018-09-04 |
| Centering Substrates On A Chuck App 20180240694 - Adderly; Shawn A. ; et al. | 2018-08-23 |
| Centering substrates on a chuck Grant 9,997,385 - Adderly , et al. June 12, 2 | 2018-06-12 |
| Centering Substrates On A Chuck App 20170221742 - Adderly; Shawn A. ; et al. | 2017-08-03 |
| Integrated Circuit Heat Dissipation Using Nanostructures App 20170200665 - BOTULA; Alan B. ; et al. | 2017-07-13 |
| Integrated circuit heat dissipation using nanostructures Grant 9,704,978 - Botula , et al. July 11, 2 | 2017-07-11 |
| Apparatus and method for centering substrates on a chuck Grant 9,685,362 - Adderly , et al. June 20, 2 | 2017-06-20 |
| Integrated circuit heat dissipation using nanostructures Grant 9,666,701 - Botula , et al. May 30, 2 | 2017-05-30 |
| Integrated Circuit Heat Dissipation Using Nanostructures App 20170117206 - BOTULA; Alan B. ; et al. | 2017-04-27 |
| Tsv wafer with improved fracture strength Grant 9,607,929 - Adkisson , et al. March 28, 2 | 2017-03-28 |
| Integrated circuit heat dissipation using nanostructures Grant 9,601,606 - Botula , et al. March 21, 2 | 2017-03-21 |
| Method and apparatus for detecting foreign material on a chuck Grant 9,508,578 - Adderly , et al. November 29, 2 | 2016-11-29 |
| Integrated Circuit Heat Dissipation Using Nanostructures App 20160204048 - BOTULA; ALAN B. ; et al. | 2016-07-14 |
| Integrated Circuit Heat Dissipation Using Nanostructures App 20160204233 - BOTULA; ALAN B. ; et al. | 2016-07-14 |
| Integrated Circuit Heat Dissipation Using Nanostructures App 20160126158 - BOTULA; Alan B. ; et al. | 2016-05-05 |
| Integrated circuit heat dissipation using nanostructures Grant 9,324,628 - Botula , et al. April 26, 2 | 2016-04-26 |
| Methods of forming a TSV wafer with improved fracture strength Grant 9,312,205 - Adkisson , et al. April 12, 2 | 2016-04-12 |
| Uniform roughness on backside of a wafer Grant 9,275,868 - Adderly , et al. March 1, 2 | 2016-03-01 |
| Tsv Wafer With Improved Fracture Strength App 20150348876 - Adkisson; James W. ; et al. | 2015-12-03 |
| Tsv Wafer Fracture Strength App 20150255404 - Adkisson; James W. ; et al. | 2015-09-10 |
| Integrated Circuit Heat Dissipation Using Nanostructures App 20150243578 - BOTULA; Alan B. ; et al. | 2015-08-27 |
| Apparatus and Method for Centering Substrates on a Chuck App 20150235881 - Adderly; Shawn A. ; et al. | 2015-08-20 |
| Method And Apparatus For Detecting Foreign Material On A Chuck App 20150219479 - Adderly; Shawn A. ; et al. | 2015-08-06 |
| Uniform Roughness On Backside Of A Wafer App 20150021743 - ADDERLY; Shawn A. ; et al. | 2015-01-22 |
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