LIEW; How Kiat
Patent Applications and Registrations
Patent applications and USPTO patent grants for LIEW; How Kiat.The latest application filed is for "molded semiconductor package and related methods".
- LIEW; How Kiat - Bukit Jalil MY
- Liew; How Kiat - Ipoh MY
| Patent | Date |
|---|---|
| Molded Semiconductor Package And Related Methods App 20220157756 - WANG; Sw ; et al. | 2022-05-19 |
| Molded semiconductor package and related methods Grant 11,244,918 - Wang , et al. February 8, 2 | 2022-02-08 |
| Quad Flat No Leads Package With Locking Feature App 20210043550 - WANG; Soon Wei ; et al. | 2021-02-11 |
| Thin Semiconductor Package And Related Methods App 20200357697 - KRISHNAN; Shutesh ; et al. | 2020-11-12 |
| Quad flat no leads package with locking feature Grant 10,825,754 - Wang , et al. November 3, 2 | 2020-11-03 |
| Thin semiconductor package and related methods Grant 10,763,173 - Krishnan , et al. Sep | 2020-09-01 |
| Thin Semiconductor Package And Related Methods App 20190252255 - KRISHNAN; Shutesh ; et al. | 2019-08-15 |
| Thin semiconductor package and related methods Grant 10,319,639 - Krishnan , et al. | 2019-06-11 |
| Thin Semiconductor Package And Related Methods App 20190057900 - KRISHNAN; Shutesh ; et al. | 2019-02-21 |
| Molded Semiconductor Package And Related Methods App 20190057947 - WANG; Sw ; et al. | 2019-02-21 |
| Quad Flat No Leads Package App 20180040539 - WANG; Soon Wei ; et al. | 2018-02-08 |
| Die support for enlarging die size Grant 9,748,163 - Wang , et al. August 29, 2 | 2017-08-29 |
| Packaged Semiconductor Devices And Related Methods App 20170162742 - PRAJUCKAMOL; Atapol ; et al. | 2017-06-08 |
| Packaged Semiconductor Devices And Related Methods App 20160111581 - Prajuckamol; Atapol ; et al. | 2016-04-21 |
| Chip scale packages and related methods Grant 9,281,258 - Fon , et al. March 8, 2 | 2016-03-08 |
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