loadpatents
Patent applications and USPTO patent grants for Lien; Siou-Cheng.The latest application filed is for "stacking structure and touch sensor".
Patent | Date |
---|---|
Stacking Structure And Touch Sensor App 20220283653 - Hsiao; Chung-Chin ;   et al. | 2022-09-08 |
Stack structure and touch sensor Grant 11,360,622 - Hsiao , et al. June 14, 2 | 2022-06-14 |
Transparent Conductive Film And Touch Panel Comprising The Same App 20220164064 - Hsiao; Chung-Chin ;   et al. | 2022-05-26 |
Stack Structure And Touch Sensor App 20220121320 - Hsiao; Chung-Chin ;   et al. | 2022-04-21 |
Transparent conductive film, manufacturing method of a transparent conductive film and touch panel Grant 11,294,513 - Hsiao , et al. April 5, 2 | 2022-04-05 |
Photosensitive Electrically Conductive Structure And Touch Sensor App 20220088909 - Hsiao; Chung-Chin ;   et al. | 2022-03-24 |
Touch panel and manufacturing method thereof Grant 11,249,605 - Hsiao , et al. February 15, 2 | 2022-02-15 |
Touch panel and manufacturing method thereof Grant 11,061,501 - Hsiao , et al. July 13, 2 | 2021-07-13 |
Etching Solution, Touch Panel And Manufacturing Method Thereof App 20210200383 - Hsiao; Chung-Chin ;   et al. | 2021-07-01 |
Electrode structure and touch panel thereof Grant 10,963,118 - Hsiao , et al. March 30, 2 | 2021-03-30 |
Touch Panel And Manufacturing Method Thereof App 20210041986 - Hsiao; Chung-Chin ;   et al. | 2021-02-11 |
Double-sided electrode structure and patterning process thereof Grant 10,840,275 - Hsiao , et al. November 17, 2 | 2020-11-17 |
Touch Panel And Manufacturing Method Thereof App 20200301557 - HSIAO; Chung-Chin ;   et al. | 2020-09-24 |
Electrode Structure And Touch Panel Thereof App 20200272263 - HSIAO; Chung-Chin ;   et al. | 2020-08-27 |
Touch sensing panel and manufacturing method thereof Grant 10,642,436 - Hsiao , et al. | 2020-05-05 |
Touch Sensing Panel And Manufacturing Method Thereof App 20190384429 - Hsiao; Chung-Chin ;   et al. | 2019-12-19 |
Double-sided Electrode Structure And Patterning Process Thereof App 20190371830 - Hsiao; Chung-Chin ;   et al. | 2019-12-05 |
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