Lien; Chung-Cheng

Patent Applications and Registrations

Patent applications and USPTO patent grants for Lien; Chung-Cheng.The latest application filed is for "circuit board structure with capacitors embedded therein and method for fabricating the same".

Company Profile

0.11.28

Lien; Chung-Cheng - Hsinchu N/A TW
LIEN; Chung-Cheng - Hsin-feng TW
Lien; Chung Cheng - Hsin-Chu TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Circuit board structure with capacitors embedded therein Grant 8,642,898 - Lien , et al. February 4, 2	2014-02-04
Circuit Board Structure With Capacitors Embedded Therein And Method For Fabricating The Same App 20120292089 - LIEN; Chung-Cheng ; et al.	2012-11-22
Method for fabricating circuit board structure with capacitors embedded therein Grant 8,256,106 - Lien , et al. September 4, 2	2012-09-04
Circuit board structure embedded with semiconductor chips Grant 7,863,729 - Hsu , et al. January 4, 2	2011-01-04
Stack structure of circuit boards embedded with semiconductor chips Grant 7,706,148 - Hsu , et al. April 27, 2	2010-04-27
Circuit board structure having capacitor array and embedded electronic component and method for fabricating the same Grant 7,674,986 - Chang , et al. March 9, 2	2010-03-09
Stack structure of circuit board with semiconductor component embedded therein Grant 7,656,040 - Hsu , et al. February 2, 2	2010-02-02
Carrier structure for semiconductor chip and method for manufacturing the same Grant 7,619,317 - Lien , et al. November 17, 2	2009-11-17
Plate structure having chip embedded therein and the manufacturing method of the same Grant 7,598,610 - Hsu , et al. October 6, 2	2009-10-06
Circuit Board Structure Embedded With Semiconductor Chips App 20090200658 - HSU; Shih Ping ; et al.	2009-08-13
Stack structure of circuit boards embedded with semiconductor chips App 20090091903 - Hsu; Shih Ping ; et al.	2009-04-09
Stack structure of carrier board embedded with semiconductor components and method for fabricating the same Grant 7,514,770 - Chang , et al. April 7, 2	2009-04-07
Stack structure of carrier boards embedded with semiconductor components and method for fabricating the same Grant 7,507,915 - Chang , et al. March 24, 2	2009-03-24
Packaging Substrate Having Chip Embedded Therein And Manufacturing Method Thereof App 20090032930 - Hsu; Shih-Ping ; et al.	2009-02-05
Structure of packaging substrate having capacitor embedded therein and method for fabricating the same App 20080308309 - Lien; Chung-Cheng ; et al.	2008-12-18
Multi-chip Semiconductor Package Structure App 20080237832 - Hsu; Shih-Ping ; et al.	2008-10-02
Multi-chip Semiconductor Package Structure App 20080237833 - Hsu; Shih-Ping ; et al.	2008-10-02
Multi-chip Semiconductor Package Structure App 20080237831 - Hsu; Shih-Ping ; et al.	2008-10-02
Chip package module App 20080230892 - CHANG; Chia-Wei ; et al.	2008-09-25
Package structure and stacked package module using the same App 20080224295 - Lien; Chung-Cheng ; et al.	2008-09-18
Semiconductor packaging substrate structure with capacitor embedded therein App 20080217739 - Lien; Chung-Cheng ; et al.	2008-09-11
Circuit board structure with capacitors embedded therein and method for fabricating the same App 20080210460 - Lien; Chung-Cheng ; et al.	2008-09-04
Carrier plate structure havign a chip embedded therein and the manufacturing method of the same App 20080185704 - Hsu; Shih-Ping ; et al.	2008-08-07
Plate structure having chip embedded therein and the manufacturing method of the same App 20080164597 - Hsu; Shih-Ping ; et al.	2008-07-10
Carrier structure for semiconductor chip and method for manufacturing the same App 20080116562 - Lien; Chung-Cheng ; et al.	2008-05-22
Circuit Board Assembly Having Passive Component and Stack Structure Thereof App 20080047740 - Lien; Chung-Cheng ; et al.	2008-02-28
Plate structure having chip embedded therein and the manufacturing method of the same App 20080029872 - Hsu; Shih-Ping ; et al.	2008-02-07
Circuit board structure with capacitors embedded therein and method for fabricating the same App 20080030965 - Lien; Chung-Cheng ; et al.	2008-02-07
Device Embedded With Semiconductor Chip And Stack Structure Of The Same App 20070284717 - Lien; Chung Cheng ; et al.	2007-12-13
Stack Structure Of Circuit Board With Semiconductor Component Embedded Therein App 20070278644 - Hsu; Shih-Ping ; et al.	2007-12-06
Carrier Board Structure With Chip Embedded Therein And Method For Fabricating The Same App 20070241444 - HSU; Shih-Ping ; et al.	2007-10-18
Circuit board structure embedded with semiconductor chips App 20070181995 - Hsu; Shih Ping ; et al.	2007-08-09
Circuit Board Structure Having Capacitor Array and Embedded Electronic Component and Method for Fabricating the Same App 20070147014 - Chang; Chia-Wei ; et al.	2007-06-28
Stack Structure Of Carrier Boards Embedded With Semiconductor Components And Method For Fabricating The Same App 20070084628 - Chang; Chia-Wei ; et al.	2007-04-19
Stack Structure of Carrier Board Embedded with Semiconductor Components and Method for Fabricating the same App 20070085188 - Chang; Chia Wei ; et al.	2007-04-19
Wafer structure with electroless plating metal connecting layer and method for fabricating the same App 20070087547 - Chen; Shang Wei ; et al.	2007-04-19
Semiconductor device with electroless plating metal connecting layer and method for fabricating the same App 20070085205 - Chen; Shang-Wei ; et al.	2007-04-19
Method for releasing stress of embedded chip and chip embedded structure App 20050239269 - Hu, Chu-Chin ; et al.	2005-10-27

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