Lien; Chia-Wen

Patent Applications and Registrations

Patent applications and USPTO patent grants for Lien; Chia-Wen.The latest application filed is for "reagent and kit for enhancing chemiluminescent reaction".

Company Profile

1.9.8

Lien; Chia-Wen - Keelung TW
LIEN; Chia-Wen - KEELUNG CITY TW
LIEN; Chia-Wen - Taoyuan City TW
Lien; Chia-Wen - Hsinchu County TW
Lien; Chia-Wen - Taoyuan County TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Reagent and kit for enhancing chemiluminescent reaction Grant 11,112,366 - Huang , et al. September 7, 2	2021-09-07
Reagent And Kit For Enhancing Chemiluminescent Reaction App 20200309707 - HUANG; Chih-Ching ; et al.	2020-10-01
Reagent and kit for performing chemiluminescent reaction Grant 10,711,185 - Lee , et al.	2020-07-14
Reagent And Kit For Performing Chemiluminescent Reaction App 20200017764 - LEE; Cheng-Yen ; et al.	2020-01-16
Reactive black dye composition and method for dying fibers using the same App 20190031881 - CHEN; Chien-Yu ; et al.	2019-01-31
Wafer level chip scale package having continuous through hole via configuration and fabrication method thereof Grant 9,972,554 - Fang , et al. May 15, 2	2018-05-15
Wafer Level Chip Scale Package Having Continuous Through Hole Via Configuration And Fabrication Method Thereof App 20170256471 - Fang; Li-Chih ; et al.	2017-09-07
Method for supporting semiconductor wafer and wafer supporting assembly Grant 8,776,363 - Hsu , et al. July 15, 2	2014-07-15
Thinned wafer and fabricating method thereof Grant 8,754,504 - Hsu , et al. June 17, 2	2014-06-17
Method For Supporting Semiconductor Wafer And Wafer Supporting Assembly App 20130312246 - Hsu; Chang-Sheng ; et al.	2013-11-28
Thinned Wafer And Fabricating Method Thereof App 20130313691 - Hsu; Chang-Sheng ; et al.	2013-11-28
Wafer with eutectic bonding carrier and method of manufacturing the same Grant 8,536,709 - Hsu , et al. September 17, 2	2013-09-17

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