Liehr; Michael

Patent Applications and Registrations

Patent applications and USPTO patent grants for Liehr; Michael.The latest application filed is for "plasma-chemical coating apparatus".

Company Profile

1.13.11

Liehr; Michael - Buedingen DE
LIEHR; Michael - Buedlingen DE
Liehr; Michael - Guilderland NY US
Liehr; Michael - Feldatal DE
Liehr; Michael - Essex Junction DE
Liehr; Michael - Yorktown Heights NY

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Plasma-chemical coating apparatus Grant 10,186,401 - Liehr , et al. Ja	2019-01-22
Plasma-chemical Coating Apparatus App 20160211122 - LIEHR; Michael ; et al.	2016-07-21
Apparatus and method for integration of through substrate vias Grant 8,969,200 - Hebding , et al. March 3, 2	2015-03-03
Method for thin die-to-wafer bonding Grant 8,697,542 - Pascual , et al. April 15, 2	2014-04-15
Apparatus And Method For Thin Die-to-wafer Bonding App 20130273691 - PASCUAL; Daniel ; et al.	2013-10-17
Apparatus And Method For Integration Of Through Substrate Vias App 20130270711 - HEBDING; Jeremiah ; et al.	2013-10-17
System And Method For Control Of Electromagnetic Radiation In Pecvd Discharge Processes App 20080113108 - Stowell; Michael W. ; et al.	2008-05-15
Low-k Dielectric Layers For Large Substrates App 20070190808 - Stowell; Michael W. ; et al.	2007-08-16
System and method for power function ramping of microwave liner discharge sources App 20070095281 - Stowell; Michael W. ; et al.	2007-05-03
Magnetron sputtering device, a cylindrical cathode and a method of coating thin multicomponent films on a substrate App 20060032737 - Liehr; Michael	2006-02-16
Method for direct chip attach by solder bumps and an underfill layer Grant 6,566,612 - Brouillette , et al. May 20, 2	2003-05-20
Method for the production of gas- and liquid-impermeable layers on a substrate App 20030000826 - Krempel-Hesse, Jorg ; et al.	2003-01-02
Device for the plasma deposition of a polycrystalline diamond Grant 6,487,986 - Liehr , et al. December 3, 2	2002-12-03
Method for transporting at least one vaporous substance through the wall of a vacuum chamber and into the vacuum chamber and a device for executing and utilizing the method Grant 6,416,292 - Liehr July 9, 2	2002-07-09
Method for direct chip attach by solder bumps and an underfill layer App 20020062556 - Brouillette, Guy P. ; et al.	2002-05-30
Method for direct chip attach by solder bumps and an underfill layer Grant 6,341,418 - Brouillette , et al. January 29, 2	2002-01-29
Interconnect for low temperature chip attachment Grant 6,127,735 - Berger , et al. October 3, 2	2000-10-03
Apparatus for the plasma-chemical deposition of polycrystalline diamond Grant 5,900,065 - Liehr , et al. May 4, 1	1999-05-04
Direct chip attach for low alpha emission interconnect system Grant 5,897,336 - Brouillette , et al. April 27, 1	1999-04-27
Motive structure for transporting workpieces Grant 4,794,863 - Gates , et al. January 3, 1	1989-01-03

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