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Patent applications and USPTO patent grants for Lieb; Bryan.The latest application filed is for "acid copper electroplating bath and method for electroplating low internal stress and good ductiility copper deposits".
Patent | Date |
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Plating method Grant 9,809,891 - Thorseth , et al. November 7, 2 | 2017-11-07 |
Acid Copper Electroplating Bath And Method For Electroplating Low Internal Stress And Good Ductiility Copper Deposits App 20160312372 - WEI; Lingyun ;   et al. | 2016-10-27 |
Plating Method App 20150376807 - THORSETH; Matthew A. ;   et al. | 2015-12-31 |
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