Lichtenberger; Heiner
Patent Applications and Registrations
Patent applications and USPTO patent grants for Lichtenberger; Heiner.The latest application filed is for "gold-tin-indium solder for processing compatibility with lead-free tin-based solder".
- Lichtenberger; Heiner - Williamsville NY
| Patent | Date |
|---|---|
| Gold-tin-indium solder for processing compatibility with lead-free tin-based solder Grant 8,294,271 - Lichtenberger October 23, 2 | 2012-10-23 |
| Gold-tin-indium Solder For Processing Compatibility With Lead-free Tin-based Solder App 20110180929 - Lichtenberger; Heiner | 2011-07-28 |
| Alloys for flip chip interconnects and bumps App 20070114663 - Brown; Derrick L. ; et al. | 2007-05-24 |
| Copper based alloys and optical media containing same App 20060127630 - Lichtenberger; Heiner | 2006-06-15 |
| Silver-reactive metal alloys for optical data storage and recordable storage media containing same Grant 7,033,730 - Lichtenberger , et al. April 25, 2 | 2006-04-25 |
| Silver alloys for optical data storage and optical media containing same App 20050048251 - Lichtenberger, Heiner | 2005-03-03 |
| Silver-reactive metal alloys for optical data storage and recordable storage media containing same App 20040048193 - Lichtenberger, Heiner ; et al. | 2004-03-11 |
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