Licht; Thomas

Patent Applications and Registrations

Patent applications and USPTO patent grants for Licht; Thomas.The latest application filed is for "device and method for making a semiconductor device including bonding two bonding partners".

Company Profile

0.11.14

Licht; Thomas - Warstein DE

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Device and method for making a semiconductor device including bonding two bonding partners Grant 8,439,249 - Speckels , et al. May 14, 2	2013-05-14
Semiconductor module Grant 8,198,721 - Bayerer , et al. June 12, 2	2012-06-12
Method and device for producing a bondable area region on a carrier Grant 8,167,187 - Bayerer , et al. May 1, 2	2012-05-01
Electrical component on a substrate and method for production thereof Grant 7,807,931 - Auerbach , et al. October 5, 2	2010-10-05
Arrangement for cooling a power semiconductor module Grant 7,755,185 - Bayerer , et al. July 13, 2	2010-07-13
Method for the structured application of a laminatable film to a substrate for a semiconductor module Grant 7,742,843 - Licht , et al. June 22, 2	2010-06-22
Device And Method For Making A Semiconductor Device Including Bonding Two Bonding Partners App 20100078463 - SPECKELS; Roland ; et al.	2010-04-01
Composite material and base plate Grant 7,566,490 - Mitic , et al. July 28, 2	2009-07-28
Power semiconductor arrangement Grant 7,557,442 - Licht July 7, 2	2009-07-07
High-voltage module and method for producing same Grant 7,407,836 - Bayerer , et al. August 5, 2	2008-08-05
Arrangement for cooling a power semiconductor module App 20080079021 - Bayerer; Reinhold ; et al.	2008-04-03
Power semiconductor arrangement App 20070200227 - Licht; Thomas ; et al.	2007-08-30
Electrical component on a substrate and method for production thereof App 20070175656 - Auerbach; Franz ; et al.	2007-08-02
Composite Material And Base Plate App 20070122587 - Mitic; Gerhard ; et al.	2007-05-31
Method for the structured application of a laminatable film to a substrate for a semiconductor module App 20070111475 - Licht; Thomas ; et al.	2007-05-17
Assembly of an electrical component comprising an electrical insulation film on a substrate and method for producing said assembly App 20070036944 - Auerbach; Franz ; et al.	2007-02-15
Semiconductor substrate, method for producing it, and method for producing a circuit module App 20070013046 - Bayerer; Reinhold ; et al.	2007-01-18
Circuit arrangement placed on a substrate and method for producing the same App 20060267135 - Wolfgang; Eckhard ; et al.	2006-11-30
Method and device for producing a bondable area region on a carrier App 20060261133 - Bayerer; Reinhold ; et al.	2006-11-23
High voltage module and method for producing same Grant 7,078,795 - Bayerer , et al. July 18, 2	2006-07-18
Method and apparatus for controlling and monitoring a brazing process App 20060076389 - Kemper; Alfred ; et al.	2006-04-13
High-voltage module and method for producing same App 20050269683 - Bayerer, Reinhold ; et al.	2005-12-08
Power semiconductor arrangement App 20050230820 - Licht, Thomas	2005-10-20
High voltage module and method for producing same App 20040140116 - Bayerer, Reinhold ; et al.	2004-07-22

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