Libres; Jeremias P.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Libres; Jeremias P..The latest application filed is for "grooved substrates for uniform underfilling solder ball assembled electronic devices".

Company Profile

0.5.6

Libres; Jeremias P. - Garland TX
Libres; Jeremias P - Garland TX

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Grooved substrates for uniform underfilling solder ball assembled electronic devices Grant 7,550,856 - Libres , et al. June 23, 2	2009-06-23
Low profile, chip-scale package and method of fabrication Grant 7,309,648 - Kalidas , et al. December 18, 2	2007-12-18
Grooved substrates for uniform underfilling solder ball assembled electronic devices App 20070054506 - Libres; Jeremias P. ; et al.	2007-03-08
Low Profile, Chip-Scale Package and Method of Fabrication App 20070020808 - Kalidas; Navinchandra ; et al.	2007-01-25
Low profile, chip-scale package and method of fabrication Grant 7,135,781 - Kalidas , et al. November 14, 2	2006-11-14
Grooved substrates for uniform underfilling solder ball assembled electronic devices Grant 7,033,864 - Libres , et al. April 25, 2	2006-04-25
Grooved Substrates For Uniform Underfilling Solder Ball Assembled Electronic Devices App 20060049522 - Libres; Jeremias P. ; et al.	2006-03-09
Low profile, chip-scale package and method of fabrication App 20060033219 - Kalidas; Navinchandra ; et al.	2006-02-16
Heatsink-substrate-spacer structure for an integrated-circuit package Grant 6,936,919 - Chuang , et al. August 30, 2	2005-08-30
Integrated circuit package with heatsink support App 20040036162 - Chuang, Shih-Fang ; et al.	2004-02-26
Integrated circuit package with spacer App 20040037059 - Stiborek, Leon ; et al.	2004-02-26

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