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Patent applications and USPTO patent grants for Liaw; Shin-Chih.The latest application filed is for "plasma deposition apparatus and deposition method utilizing same".
Patent | Date |
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Apparatus for wet processing substrate Grant 8,464,734 - Chen , et al. June 18, 2 | 2013-06-18 |
Plasma deposition apparatus and deposition method utilizing same Grant 8,281,741 - Chang , et al. October 9, 2 | 2012-10-09 |
Apparatus for recycling metal from metal ions containing waste solution Grant 8,062,580 - Chen , et al. November 22, 2 | 2011-11-22 |
Plasma Deposition Apparatus And Deposition Method Utilizing Same App 20110120372 - Chang; Chia-Chiang ;   et al. | 2011-05-26 |
Plasma deposition apparatus and deposition method utilizing same Grant 7,923,076 - Chang , et al. April 12, 2 | 2011-04-12 |
Apparatus For Wet Processing Substrate App 20100170639 - Chen; Wen-Tsun ;   et al. | 2010-07-08 |
Apparatus For Recycling Metal From Metal Ions Containing Waste Solution App 20100059910 - CHEN; WEN-TSUN ;   et al. | 2010-03-11 |
Plasma deposition apparatus and deposition method utilizing same App 20080032063 - Chang; Chia-Chiang ;   et al. | 2008-02-07 |
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