Liaw; H. Ming
Patent Applications and Registrations
Patent applications and USPTO patent grants for Liaw; H. Ming.The latest application filed is for "non-silicon and silicon bonded structure and method of manufacture".
- Liaw; H. Ming - Scottsdale AZ
| Patent | Date |
|---|---|
| Non-silicon and silicon bonded structure and method of manufacture Grant 5,281,834 - Cambou , et al. January 25, 1 | 1994-01-25 |
| Monolithic circuit with integrated bulk structure resonator Grant 5,260,596 - Dunn , et al. November 9, 1 | 1993-11-09 |
| Method of fabricating buried insulating layers Grant 5,143,858 - Tomozane , et al. September 1, 1 | 1992-09-01 |
| Method of fabricating a dielectric isolated area Grant 5,091,330 - Cambou , et al. February 25, 1 | 1992-02-25 |
| Method of fabricating integrated silicon and non-silicon semiconductor devices Grant 5,064,781 - Cambou , et al. November 12, 1 | 1991-11-12 |
| Method of forming a defect-free semiconductor layer on insulator Grant 4,962,051 - Liaw October 9, 1 | 1990-10-09 |
| Sequential purification and crystal growth Grant 4,200,621 - Liaw , et al. April 29, 1 | 1980-04-29 |
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