loadpatents
name:-0.012650012969971
name:-0.0061430931091309
name:-0.00042581558227539
Liau; Hsing Jung Patent Filings

Liau; Hsing Jung

Patent Applications and Registrations

Patent applications and USPTO patent grants for Liau; Hsing Jung.The latest application filed is for "microsystem package structure".

Company Profile
0.5.7
  • Liau; Hsing Jung - Kaohsiung TW
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Water-level package with bump ring
Grant 6,838,762 - Tao , et al. January 4, 2
2005-01-04
Wafer-level package with a cavity and fabricating method thereof
Grant 6,822,324 - Tao , et al. November 23, 2
2004-11-23
Microsystem package structure
Grant 6,809,852 - Tao , et al. October 26, 2
2004-10-26
Microsystem Package Structure
App 20040184133 - Su, Tao ;   et al.
2004-09-23
Multichip wafer-level package and method for manufacturing the same
Grant 6,768,207 - Tao , et al. July 27, 2
2004-07-27
Optical integrated circuit element package and process for making the same
Grant 6,693,364 - Tao , et al. February 17, 2
2004-02-17
Optical Integrated Circuit Element Package And Process For Making The Same
App 20030234452 - Tao, Su ;   et al.
2003-12-25
Liquid crystal display device with bump and method for manufacturing the same
App 20030214618 - Tao, Su ;   et al.
2003-11-20
Multichip wafer-level package and method for manufacturing the same
App 20030214029 - Tao, Su ;   et al.
2003-11-20
Wafer-level package with bump and method for manufacturing the same
App 20030214007 - Tao, Su ;   et al.
2003-11-20
Optical integrated circuit element package and method for making the same
App 20030193018 - Tao, Su ;   et al.
2003-10-16
Wafer-level package with a cavity and fabricating method thereof
App 20030193096 - Tao, Su ;   et al.
2003-10-16

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