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name:-0.0039379596710205
name:-0.00055909156799316
name:-0.00081396102905273
Liau; Bee Hoon Patent Filings

Liau; Bee Hoon

Patent Applications and Registrations

Patent applications and USPTO patent grants for Liau; Bee Hoon.The latest application filed is for "flip chip and wire bond semiconductor package".

Company Profile
0.1.2
  • Liau; Bee Hoon - Selangor MY
  • Liau; Bee Hoon - Singapore SG
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Flip chip and wire bond semiconductor package
Grant 7,554,185 - Foong , et al. June 30, 2
2009-06-30
Flip Chip And Wire Bond Semiconductor Package
App 20080111248 - Foong; Chee Seng ;   et al.
2008-05-15
Semiconductor package including rivet for bonding of lead posts
App 20060012055 - Foong; Chee Seng ;   et al.
2006-01-19

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