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name:-0.010586977005005
name:-0.0083589553833008
name:-0.02646803855896
Liao; Yu-Kuang Patent Filings

Liao; Yu-Kuang

Patent Applications and Registrations

Patent applications and USPTO patent grants for Liao; Yu-Kuang.The latest application filed is for "semiconductor device with nanostructures aligned with grating coupler and manufacturing method thereof".

Company Profile
12.7.8
  • Liao; Yu-Kuang - Hsinchu City TW
  • Liao; Yu-Kuang - Hsinchu TW
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Semiconductor Device With Nanostructures Aligned With Grating Coupler And Manufacturing Method Thereof
App 20220308284 - Liao; Yu-Kuang ;   et al.
2022-09-29
Semiconductor Package And Method For Manufacturing The Same
App 20220254747 - WANG; CHUEI-TANG ;   et al.
2022-08-11
Optical semiconductor package and method for manufacturing the same
Grant 11,322,470 - Wang , et al. May 3, 2
2022-05-03
Package structure and manufacturing method thereof
Grant 10,914,895 - Liao , et al. February 9, 2
2021-02-09
Semiconductor Package
App 20210005591 - Liao; Yu-Kuang ;   et al.
2021-01-07
Semiconductor package
Grant 10,797,031 - Liao , et al. October 6, 2
2020-10-06
Semiconductor Package And Method For Manufacturing The Same
App 20200286845 - WANG; CHUEI-TANG ;   et al.
2020-09-10
Optical semiconductor package and method for manufacturing the same
Grant 10,665,560 - Wang , et al.
2020-05-26
Semiconductor Package
App 20200098736 - Liao; Yu-Kuang ;   et al.
2020-03-26
Package Structure And Manufacturing Method Thereof
App 20200091124 - Liao; Yu-Kuang ;   et al.
2020-03-19
Hybrid interconnect device and method
Grant 10,371,893 - Yu , et al.
2019-08-06
Optical transceiver
Grant 10,333,623 - Liao , et al.
2019-06-25
Hybrid Interconnect Device and Method
App 20190162901 - Yu; Chen-Hua ;   et al.
2019-05-30
Optical Semiconductor Package And Method For Manufacturing The Same
App 20190131267 - WANG; CHUEI-TANG ;   et al.
2019-05-02
Hybrid interconnect device and method
Grant 10,267,990 - Yu , et al.
2019-04-23

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