LIAO; Tsung-Jen
Patent Applications and Registrations
Patent applications and USPTO patent grants for LIAO; Tsung-Jen.The latest application filed is for "integrated fan-out structures and methods for forming the same".
- LIAO; Tsung-Jen - Zhubei City TW
- Liao; Tsung-Jen - Hsinchu TW
- Liao; Tsung-Jen - Zhubei TW
- Liao; Tsung-Jen - Pan Chiao TW
- Liao; Tsung-Jen - Taipei Hsien TW
| Patent | Date |
|---|---|
| Integrated Fan-out Structures And Methods For Forming The Same App 20210343667 - CHEN; Tsui-Mei ; et al. | 2021-11-04 |
| Carrier tape system and methods of using carrier tape system Grant 11,164,764 - Liao , et al. November 2, 2 | 2021-11-02 |
| Carrier tape system and methods of using carrier tape system Grant 11,164,763 - Liao , et al. November 2, 2 | 2021-11-02 |
| Semiconductor chip holder Grant 10,879,098 - Liao , et al. December 29, 2 | 2020-12-29 |
| Carrier Tape System And Methods Of Using Carrier Tape System App 20200266082 - LIAO; Tsung-Jen ; et al. | 2020-08-20 |
| Carrier Tape System And Methods Of Using Carrier Tape System App 20200266083 - LIAO; Tsung-Jen ; et al. | 2020-08-20 |
| Carrier tape system and methods of using carrier tape system Grant 10,679,877 - Liao , et al. | 2020-06-09 |
| Semiconductor Chip Holder App 20200090970 - Liao; Tsung-Jen ; et al. | 2020-03-19 |
| Carrier Tape System And Methods Of Using Carrier Tape System App 20200006098 - LIAO; Tsung-Jen ; et al. | 2020-01-02 |
| Semiconductor structure and method of manufacturing the same Grant 9,576,820 - Liao February 21, 2 | 2017-02-21 |
| Chip package structure Grant 9,437,542 - Liao September 6, 2 | 2016-09-06 |
| Chip Package Structure App 20160111364 - Liao; Tsung-Jen | 2016-04-21 |
| Chip package structure Grant 9,269,643 - Liao February 23, 2 | 2016-02-23 |
| Semiconductor package structure and manufacturing method thereof Grant 9,196,553 - Liao , et al. November 24, 2 | 2015-11-24 |
| Manufacturing method for micro bump structure Grant 9,190,324 - Liao November 17, 2 | 2015-11-17 |
| Chip package structure and manufacturing method thereof Grant 9,123,684 - Liao September 1, 2 | 2015-09-01 |
| Method for wafer level packaging and a package structure thereof Grant 9,087,912 - Liao July 21, 2 | 2015-07-21 |
| Chip Package Structure App 20150171013 - Liao; Tsung-Jen | 2015-06-18 |
| Chip Package Structure And Manufacturing Method Thereof App 20150162260 - Liao; Tsung-Jen | 2015-06-11 |
| Package Structure And Method For Manufacturing The Same App 20150130084 - LIAO; TSUNG JEN | 2015-05-14 |
| Lead Frame Package And Manufacturing Method Thereof App 20150123252 - LIAO; TSUNG JEN | 2015-05-07 |
| Chip structure and multi-chip stack package Grant 9,018,772 - Liao April 28, 2 | 2015-04-28 |
| Manufacturing method of wafer level package Grant 8,980,695 - Liao March 17, 2 | 2015-03-17 |
| Method For Wafer Level Packaging And A Package Structure Thereof App 20150061121 - LIAO; TSUNG JEN | 2015-03-05 |
| Ball Planting Device And Ball Planting Method Thereof App 20150053752 - LIAO; TSUNG JEN | 2015-02-26 |
| Manufacturing Method Of Wafer Level Package App 20140315355 - LIAO; TSUNG JEN | 2014-10-23 |
| Wafer level package structure Grant 8,836,144 - Liao September 16, 2 | 2014-09-16 |
| Chip Structure And Multi-chip Stack Package App 20140159253 - Liao; Tsung-Jen | 2014-06-12 |
| Semiconductor Structure And Method Of Manufacturing The Same App 20140061904 - LIAO; Tsung Jen | 2014-03-06 |
| Wafer Level Package Structure And Manufacturing Method Of The Same App 20140061899 - LIAO; TSUNG JEN | 2014-03-06 |
| Wafer Level Chip Scale Package App 20140061880 - LIAO; TSUNG JEN | 2014-03-06 |
| Semiconductor Structure App 20140061906 - LIAO; TSUNG JEN | 2014-03-06 |
| Manufacturing Method For Micro Bump Structure App 20140065814 - LIAO; TSUNG JEN | 2014-03-06 |
| Semiconductor Package Structure And Manufacturing Method Thereof App 20130049198 - Liao; Tsung-Jen ; et al. | 2013-02-28 |
| Semiconductor Package Structure And Manufacturing Method Thereof App 20130049197 - Liao; Tsung-Jen ; et al. | 2013-02-28 |
| Light emitting diode module and method for making the same Grant 8,240,882 - Liao , et al. August 14, 2 | 2012-08-14 |
| Planar light source device Grant 8,154,029 - Liao , et al. April 10, 2 | 2012-04-10 |
| Light Emitting Diode Module and Method for Making the Same App 20110157897 - Liao; Tsung-Jen ; et al. | 2011-06-30 |
| Planar Light Source Device App 20090242908 - Liao; Tsung-Jen ; et al. | 2009-10-01 |
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