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Semiconductor package structures and methods of manufacturing the same
Grant 11,239,178 - Liu , et al. February 1, 2 | 2022-02-01 |
Semiconductor package device and method of manufacturing the same
Grant 10,910,329 - Liao , et al. February 2, 2 | 2021-02-02 |
Semiconductor package device and method of manufacturing the same
Grant 10,784,208 - Liao , et al. Sept | 2020-09-22 |
Optical Device Package And Method For Manufacturing The Same
App 20200185581 - LIU; Chanyuan ; et al. | 2020-06-11 |
Semiconductor Package Structures And Methods Of Manufacturing The Same
App 20200176394 - LIU; Chanyuan ; et al. | 2020-06-04 |
Semiconductor device package and method of manufacturing the same
Grant 10,431,554 - Lin , et al. O | 2019-10-01 |
Semiconductor Package Device And Method Of Manufacturing The Same
App 20180342470 - LIAO; Kuo-Hsien ; et al. | 2018-11-29 |
Semiconductor Device Package And Method Of Manufacturing The Same
App 20180158783 - LIN; I-Chia ; et al. | 2018-06-07 |
Semiconductor packages with thermal-enhanced conformal shielding and related methods
Grant 9,984,983 - Chung , et al. May 29, 2 | 2018-05-29 |
Semiconductor device package and method of manufacturing the same
Grant 9,871,005 - Lin , et al. January 16, 2 | 2018-01-16 |
Semiconductor Device Package And Method Of Manufacturing The Same
App 20170200682 - LIN; I-Chia ; et al. | 2017-07-13 |
Semiconductor Package Device And Method Of Manufacturing The Same
App 20170077039 - Liao; Kuo-Hsien ; et al. | 2017-03-16 |
Semiconductor Packages With Thermal-enhanced Conformal Shielding And Related Methods
App 20170012007 - Chung; Chi-Sheng ; et al. | 2017-01-12 |
Semiconductor packages with thermal-enhanced conformal shielding and related methods
Grant 9,484,313 - Chung , et al. November 1, 2 | 2016-11-01 |
Semiconductor device packages
Grant 9,269,673 - Lin , et al. February 23, 2 | 2016-02-23 |
Semiconductor package structure and semiconductor process
Grant 9,190,367 - Liao , et al. November 17, 2 | 2015-11-17 |
Semiconductor device packages having electromagnetic interference shielding and related methods
Grant 9,070,793 - Liao , et al. June 30, 2 | 2015-06-30 |
Semiconductor package integrated with conformal shield and antenna
Grant 9,007,273 - Liao , et al. April 14, 2 | 2015-04-14 |
Semiconductor Packages With Thermal-enhanced Conformal Shielding And Related Methods
App 20140239464 - Chung; Chi-Sheng ; et al. | 2014-08-28 |
Semiconductor package integrated with conformal shield and antenna
Grant 8,786,060 - Yen , et al. July 22, 2 | 2014-07-22 |
Semiconductor packages with thermal dissipation structures and EMI shielding
Grant 8,704,341 - Lin , et al. April 22, 2 | 2014-04-22 |
Semiconductor device packages with electromagnetic interference shielding
Grant 8,653,633 - Liao , et al. February 18, 2 | 2014-02-18 |
Semiconductor Packages With Thermal Dissipation Structures And Emi Shielding
App 20130307128 - Lin; I-Chia ; et al. | 2013-11-21 |
Semiconductor Package Integrated With Conformal Shield And Antenna
App 20130292808 - Yen; Han-Chee ; et al. | 2013-11-07 |
Wafer-level semiconductor device packages with electromagnetic interference shielding
Grant 8,378,466 - Chiu , et al. February 19, 2 | 2013-02-19 |
Package having an inner shield and method for making the same
Grant 8,247,889 - Liao , et al. August 21, 2 | 2012-08-21 |
Chip package and manufacturing method thereof
Grant 8,212,340 - Liao July 3, 2 | 2012-07-03 |
Semiconductor device packages with electromagnetic interference shielding
Grant 8,212,339 - Liao , et al. July 3, 2 | 2012-07-03 |
Wireless communication module
Grant 8,144,479 - Liao , et al. March 27, 2 | 2012-03-27 |
Semiconductor Package Integrated With Conformal Shield And Antenna
App 20120062439 - Liao; Kuo-Hsien ; et al. | 2012-03-15 |
Semiconductor Device Packages Having Electromagnetic Interference Shielding And Related Methods
App 20120025356 - Liao; Kuo-Hsien ; et al. | 2012-02-02 |
Semiconductor Device Packages With Electromagnetic Interference Shielding
App 20110260301 - Liao; Kuo-Hsien ; et al. | 2011-10-27 |
Package structure for wireless communication module
Grant 8,039,930 - Liao , et al. October 18, 2 | 2011-10-18 |
Semiconductor device packages with electromagnetic interference shielding
Grant 7,989,928 - Liao , et al. August 2, 2 | 2011-08-02 |
Wafer-Level Semiconductor Device Packages with Electromagnetic Interference Shielding
App 20110115060 - Chiu; Chi-Tsung ; et al. | 2011-05-19 |
Package Having An Inner Shield And Method For Making The Same
App 20110090659 - Liao; Kuo-Hsien ; et al. | 2011-04-21 |
Chip Package And Manufacturing Method Thereof
App 20110006408 - LIAO; KUO-HSIEN | 2011-01-13 |
Metallic cover of miniaturization module
Grant 7,787,250 - Li , et al. August 31, 2 | 2010-08-31 |
Semiconductor Device Packages With Electromagnetic Interference Shielding
App 20100207259 - Liao; Kuo-Hsien ; et al. | 2010-08-19 |
Package Structure For Wireless Communication Module
App 20100200965 - LIAO; KUO-HSIEN ; et al. | 2010-08-12 |
Semiconductor Device Packages With Electromagnetic Interference Shielding
App 20090256244 - Liao; Kuo-Hsien ; et al. | 2009-10-15 |
Metallic cover of miniaturization module
App 20090166830 - Li; Kuan-Hsing ; et al. | 2009-07-02 |
Method of manufacturing pins of miniaturization chip module
App 20090162976 - Li; Kuan-Hsing ; et al. | 2009-06-25 |
Wireless communication module
App 20090161334 - Liao; Kuo-Hsien ; et al. | 2009-06-25 |
Communication Module Package Assembly
App 20080291639 - Li; Kuan-Hsing ; et al. | 2008-11-27 |
Wireless Communication Nodule Assembly
App 20080291654 - Liao; Kuo-Hsien ; et al. | 2008-11-27 |
Small-sized Communication Module Package
App 20080291637 - Li; Kuan-Hsing ; et al. | 2008-11-27 |
Communications Module
App 20080207016 - Li; Kuan-Hsing ; et al. | 2008-08-28 |
Miniaturized multi-chip module and method for manufacturing the same
Grant 7,312,518 - Liao , et al. December 25, 2 | 2007-12-25 |
Miniaturized multi-chip module and method for manufacturing the same
App 20060249838 - Liao; Kuo-Hsien ; et al. | 2006-11-09 |
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