Liao; Kao-Feng

Patent Applications and Registrations

Patent applications and USPTO patent grants for Liao; Kao-Feng.The latest application filed is for "composition and method for polishing and integrated circuit".

Company Profile

7.9.13

Liao; Kao-Feng - Hsinchu TW
LIAO; KAO-FENG - HSINCHU CITY TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor device structure with interconnect structure and method for forming the same Grant 11,417,566 - Kung , et al. August 16, 2	2022-08-16
Chemical mechanical polishing method Grant 11,373,879 - Chen , et al. June 28, 2	2022-06-28
Composition And Method For Polishing And Integrated Circuit App 20220017780 - CUI; JI ; et al.	2022-01-20
Slurry Composition And Method For Polishing And Integratged Circuit App 20210371702 - CUI; JI ; et al.	2021-12-02
FinFET contacts and method forming same Grant 11,189,727 - Jangjian , et al. November 30, 2	2021-11-30
Semiconductor structure with doped contact plug and method for forming the same Grant 11,145,751 - Chen , et al. October 12, 2	2021-10-12
Chemical Mechanical Polish Slurry and Method of Manufacture App 20210313190 - Kung; Chun-Hao ; et al.	2021-10-07
Chemical mechanical polish slurry and method of manufacture Grant 11,043,396 - Kung , et al. June 22, 2	2021-06-22
Chemical Mechanical Planarization Tool App 20210053180 - Yen; Michael ; et al.	2021-02-25
Finfet Contacts And Method Forming Same App 20210057571 - Jangjian; Peng-Chung ; et al.	2021-02-25
Chemical Mechanical Polishing Method App 20200411329 - CHEN; TUNG-KAI ; et al.	2020-12-31
Chemical mechanical polishing method Grant 10,777,423 - Chen , et al. Sept	2020-09-15
Semiconductor Device Structure with Interconnect Structure and Method for Forming the Same App 20200043777 - Kung; Chun-Hao ; et al.	2020-02-06
Chemical Mechanical Polish Slurry and Method of Manufacture App 20200043745 - Kung; Chun-Hao ; et al.	2020-02-06
Semiconductor Structure With Doped Contact Plug And Method For Forming The Same App 20190305107 - CHEN; Kuo-Ju ; et al.	2019-10-03
Chemical Mechanical Polishing Method App 20190157103 - CHEN; TUNG-KAI ; et al.	2019-05-23
Wafer cleaning module Grant 9,337,066 - Yen , et al. May 10, 2	2016-05-10
CMP-friendly coatings for planar recessing or removing of variable-height layers Grant 9,281,192 - Liu , et al. March 8, 2	2016-03-08
Cmp-friendly Coatings For Planar Recessing Or Removing Of Variable-height Layers App 20150262812 - Liu; Wen-Kuei ; et al.	2015-09-17
Wafer Cleaning Module App 20150122291 - Yen; Yu-Ting ; et al.	2015-05-07
Construction of thin strain-relaxed SiGe layers and method for fabricating the same Grant 7,202,512 - Chen , et al. April 10, 2	2007-04-10
Construction of thin strain-relaxed SiGe layers and method for fabricating the same App 20050179028 - Chen, Pang-Shiu ; et al.	2005-08-18

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