Liao; Hsueh-Kuo
Patent Applications and Registrations
Patent applications and USPTO patent grants for Liao; Hsueh-Kuo.The latest application filed is for "package structure of power module".
- Liao; Hsueh-Kuo - Taoyuan TW
- LIAO; Hsueh-Kuo - Taoyuan City TW
- Liao; Hsueh-Kuo - Taoyuan Hsien TW
- Liao; Hsueh Kuo - Taipei Hsien TW
- Liao, Hsueh Kuo - Hsin Tien City TW
| Patent | Date |
|---|---|
| Package structure of power module Grant 10,806,046 - Chen , et al. October 13, 2 | 2020-10-13 |
| Package Structure Of Power Module App 20200267867 - CHEN; Shao-Chuan ; et al. | 2020-08-20 |
| Power module having packaging structure Grant 9,999,145 - Chi , et al. June 12, 2 | 2018-06-12 |
| Power Module Having Packaging Structure App 20170374755 - CHI; Wei-Hao ; et al. | 2017-12-28 |
| Integrated power module packaging structure Grant 9,848,518 - Yuan , et al. December 19, 2 | 2017-12-19 |
| Package structure of power module Grant 9,698,507 - Chang , et al. July 4, 2 | 2017-07-04 |
| Package Structure Of Power Module App 20160218454 - CHANG; KAI-TI ; et al. | 2016-07-28 |
| Integrated Power Module Packaging Structure App 20140198454 - YUAN; Te-Wei ; et al. | 2014-07-17 |
| Electroluminescent module with thermal-conducting carrier substrate Grant 7,999,450 - Shiue , et al. August 16, 2 | 2011-08-16 |
| Electroluminescent device Grant 7,897,988 - Chen , et al. March 1, 2 | 2011-03-01 |
| Electroluminescent Device And Fabrication Method Thereof App 20090294790 - CHEN; Shih-Peng ; et al. | 2009-12-03 |
| Electroluminescent device and fabrication method thereof Grant 7,625,769 - Chen , et al. December 1, 2 | 2009-12-01 |
| Chip package mechanism Grant 7,528,472 - Liao , et al. May 5, 2 | 2009-05-05 |
| Electroluminescent Device And Fabrication Method Thereof App 20080142824 - CHEN; Shih-Peng ; et al. | 2008-06-19 |
| Electroluminescent Device And Fabrication Method Thereof App 20080142825 - Chen; Shih-Peng ; et al. | 2008-06-19 |
| Electroluminescent Module App 20080143245 - SHIUE; Ching-Chuan ; et al. | 2008-06-19 |
| Electroluminescent Device And Manufacturing Method Thereof App 20080142826 - Cheng; Chuan-Chia ; et al. | 2008-06-19 |
| Manufacturing method of suspended microstructure App 20070224720 - Lee; Cheng-Chang ; et al. | 2007-09-27 |
| Chip package mechanism App 20060113660 - Liao; Hsueh-Kuo ; et al. | 2006-06-01 |
| Stack chip package structure Grant 6,919,628 - Lee , et al. July 19, 2 | 2005-07-19 |
| [stack Chip Package Structure] App 20040140546 - LEE, I-TSENG ; et al. | 2004-07-22 |
| Leadframe pakaging apparatus and packaging method thereof App 20040094826 - Yang, Chin An ; et al. | 2004-05-20 |
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