Liao; Hsien-Ken
Patent Applications and Registrations
Patent applications and USPTO patent grants for Liao; Hsien-Ken.The latest application filed is for "sound producing package structure and manufacturing method thereof".
- Liao; Hsien-Ken - Taichung TW
- Liao; Hsien-Ken - Taichung City TW
| Patent | Date |
|---|---|
| Package structure and methods of manufacturing sound producing chip, forming package structure and forming sound producing apparatus Grant 11,252,511 - Lo , et al. February 15, 2 | 2022-02-15 |
| Sound Producing Package Structure And Manufacturing Method Thereof App 20210314688 - Lo; Chiung C. ; et al. | 2021-10-07 |
| Package Structure And Methods Of Manufacturing Sound Producing Chip, Forming Package Structure And Forming Sound Producing Apparatus App 20210297787 - Lo; Chiung C. ; et al. | 2021-09-23 |
| MEMS microphone package Grant 10,362,377 - Liao , et al. | 2019-07-23 |
| MEMS microphone package Grant 10,362,406 - Yeh , et al. | 2019-07-23 |
| MEMS microphone package Grant 10,299,046 - Liao , et al. | 2019-05-21 |
| Mems Microphone Package App 20180063645 - YEH; Yao-Ting ; et al. | 2018-03-01 |
| Microelectromechanical Microphone Package Structure App 20180063616 - LIAO; Hsien-Ken ; et al. | 2018-03-01 |
| Mems Microphone Package App 20180063615 - LIAO; Hsien-Ken ; et al. | 2018-03-01 |
| Mems Microphone Package App 20180063646 - LIAO; Hsien-Ken ; et al. | 2018-03-01 |
| Flip-chip Mems Microphone App 20160157024 - LIAO; Hsien-Ken ; et al. | 2016-06-02 |
| MEMS microphone packaging method Grant 9,309,108 - Liao , et al. April 12, 2 | 2016-04-12 |
| Stacked Mems Microphone Packaging Method App 20160052780 - LIAO; Hsien-Ken ; et al. | 2016-02-25 |
| Mems Microphone Packaging Method App 20160052779 - LIAO; Hsien-Ken ; et al. | 2016-02-25 |
| Stacked MEMS microphone packaging method Grant 9,260,298 - Liao , et al. February 16, 2 | 2016-02-16 |
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