Liao; Defu

Patent Applications and Registrations

Patent applications and USPTO patent grants for Liao; Defu.The latest application filed is for "interconnection system, and interconnection control method and apparatus".

Company Profile

5.5.6

Liao; Defu - Shenzhen CN
Liao; Defu - Hangzhou CN

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Interconnection system, and interconnection control method and apparatus Grant 11,100,039 - Liao , et al. August 24, 2	2021-08-24
Central processing unit CPU hot-remove method and apparatus, and central processing unit CPU hot-add method and apparatus Grant 10,846,186 - Zhang , et al. November 24, 2	2020-11-24
Method and apparatus for triggering raid reconstruction Grant 10,732,870 - Liao , et al.	2020-08-04
Interconnection System, and Interconnection Control Method and Apparatus App 20200065291 - Liao; Defu ; et al.	2020-02-27
Method And Apparatus For Triggering Raid Reconstruction App 20190129634 - LIAO; Defu ; et al.	2019-05-02
D2D communication discovery method, apparatus, and system Grant 10,212,537 - Liao , et al. Feb	2019-02-19
D2D link discovery method Grant 10,154,531 - Liao , et al. Dec	2018-12-11
Cpu Interconnect Apparatus And System, And Cpu Interconnect Control Method And Control Apparatus App 20180181536 - Liao; Defu	2018-06-28
Central Processing Unit CPU Hot-Remove Method and Apparatus, and Central Processing Unit CPU Hot-Add Method and Apparatus App 20180129574 - Zhang; Fei ; et al.	2018-05-10
D2D Communication Discovery Method, Apparatus, and System App 20170041973 - Liao; Defu ; et al.	2017-02-09
D2d Link Discovery Method App 20170041974 - Liao; Defu ; et al.	2017-02-09

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