Liao; Chien-Ko
Patent Applications and Registrations
Patent applications and USPTO patent grants for Liao; Chien-Ko.The latest application filed is for "automated inspection tool".
- Liao; Chien-Ko - Taichung TW
- Liao; Chien-Ko - Taichung City TW
| Patent | Date |
|---|---|
| Defect offset correction Grant 11,430,108 - Liao , et al. August 30, 2 | 2022-08-30 |
| Automated Inspection Tool App 20220059415 - Lin; Chia-Han ; et al. | 2022-02-24 |
| Automated inspection tool Grant 11,171,065 - Lin , et al. November 9, 2 | 2021-11-09 |
| Defect Offset Correction App 20210065347 - LIAO; Chien-Ko ; et al. | 2021-03-04 |
| Semiconductor Equipment Management Method, Electronic Device, And Non-transitory Computer Readable Storage Medium App 20210063984 - Li; Sing-Tsung ; et al. | 2021-03-04 |
| Automatic in-line inspection system Grant 10,872,794 - Liao , et al. December 22, 2 | 2020-12-22 |
| Semiconductor equipment management method, electronic device, and non-transitory computer readable storage medium Grant 10,852,704 - Li , et al. December 1, 2 | 2020-12-01 |
| Defect offset correction Grant 10,839,507 - Liao , et al. November 17, 2 | 2020-11-17 |
| Automated Inspection Tool App 20200043812 - Lin; Chia-Han ; et al. | 2020-02-06 |
| Automated inspection tool Grant 10,490,463 - Lin , et al. Nov | 2019-11-26 |
| Defect Offset Correction App 20190164265 - Liao; Chien-Ko ; et al. | 2019-05-30 |
| Semiconductor Equipment Management Method, Electronic Device, And Non-transitory Computer Readable Storage Medium App 20190163149 - Li; Sing-Tsung ; et al. | 2019-05-30 |
| Automated Inspection Tool App 20190035696 - Lin; Chia-Han ; et al. | 2019-01-31 |
| Automatic In-line Inspection System App 20180366357 - LIAO; Chien-Ko ; et al. | 2018-12-20 |
| Photolithography tool and method thereof Grant 9,811,000 - Liao , et al. November 7, 2 | 2017-11-07 |
| Photolithography Tool And Method Thereof App 20170123328 - LIAO; Chia-Feng ; et al. | 2017-05-04 |
| Chip stack structure using conductive film bridge adhesive technology Grant 9,553,073 - Liao , et al. January 24, 2 | 2017-01-24 |
| Copper Clad Laminate Having Barrier Structure And Method Of Manufacturing The Same App 20150255423 - LIN; Tzu-Chih ; et al. | 2015-09-10 |
| Copper Clad Laminate Having Barrier Structure And Method Of Manufacturing The Same App 20150206852 - LIN; Tzu-Chih ; et al. | 2015-07-23 |
| Gas Sensor Having Micro-package Structure And Method For Making The Same App 20150185148 - LIN; Tzu-Chih ; et al. | 2015-07-02 |
| Chip Stack Structure Using Conductive Film Bridge Adhesive Technology App 20150187735 - LIAO; Chien-Ko ; et al. | 2015-07-02 |
| Gas sensor having micro-package structure and method for making the same Grant 9,063,084 - Lin , et al. June 23, 2 | 2015-06-23 |
| Semiconductor die having a redistribution layer Grant 8,212,360 - Liao , et al. July 3, 2 | 2012-07-03 |
| Semiconductor Die Having A Redistribution Layer App 20110210446 - Liao; Chien-Ko ; et al. | 2011-09-01 |
| Semiconductor die having a redistribution layer Grant 7,939,944 - Liao , et al. May 10, 2 | 2011-05-10 |
| Semiconductor Die Having A Redistribution Layer App 20100289147 - Liao; Chien-Ko ; et al. | 2010-11-18 |
| Method of fabricating a semiconductor die having a redistribution layer Grant 7,772,047 - Liao , et al. August 10, 2 | 2010-08-10 |
| Semiconductor die having a distribution layer Grant 7,763,980 - Liao , et al. July 27, 2 | 2010-07-27 |
| Semiconductor Die Having A Redistribution Layer App 20090001610 - Liao; Chien-Ko ; et al. | 2009-01-01 |
| Method Of Fabricating A Semiconductor Die Having A Redistribution Layer App 20090004781 - Liao; Chien-Ko ; et al. | 2009-01-01 |
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