loadpatents
Patent applications and USPTO patent grants for LIAO; CHI-WEI.The latest application filed is for "light-emitting diode packaging module".
Patent | Date |
---|---|
Light-emitting Diode Packaging Module App 20220199590 - XIN; SHUNING ;   et al. | 2022-06-23 |
Light-emitting Diode Packaging Module App 20220199592 - XIN; SHUNING ;   et al. | 2022-06-23 |
Light-emitting Device And Display Screen Including The Same App 20220157793 - LIAO; Yanqiu ;   et al. | 2022-05-19 |
Laser Device And Light Guide Member Used With The Same App 20220149586 - CHEN; Hui ;   et al. | 2022-05-12 |
Light-emitting Diode Packaging Module App 20220139890 - LIN; Zhen-duan ;   et al. | 2022-05-05 |
Laser device and light guide member used with the same Grant 11,271,362 - Chen , et al. March 8, 2 | 2022-03-08 |
Laser Diode Packaging Structure And Light Source Module Including The Same App 20210126423 - CHEN; Hui ;   et al. | 2021-04-29 |
LED device Grant 10,833,232 - Li , et al. November 10, 2 | 2020-11-10 |
Laser Device And Light Guide Member Used With The Same App 20200227890 - CHEN; Hui ;   et al. | 2020-07-16 |
Led Device App 20190051799 - LI; Xing-Long ;   et al. | 2019-02-14 |
Multichip package structure for generating a symmetrical and uniform light-blending source Grant 9,048,367 - Huang , et al. June 2, 2 | 2015-06-02 |
Light-emitting element package and fabrication method thereof Grant 8,828,755 - Hsieh , et al. September 9, 2 | 2014-09-09 |
Traffic light assembly Grant 8,657,469 - Liao , et al. February 25, 2 | 2014-02-25 |
Light-emitting Element Package And Fabrication Method Thereof App 20140051193 - HSIEH; MIN-TSUN ;   et al. | 2014-02-20 |
Multichip Package Structure For Generating A Symmetrical And Uniform Light-blending Source App 20130320361 - HUANG; CHIEN CHUNG ;   et al. | 2013-12-05 |
Light-emitting element package and fabrication method thereof Grant 8,541,799 - Hsieh , et al. September 24, 2 | 2013-09-24 |
Traffic Light Assembly App 20130242554 - LIAO; CHI-WEI ;   et al. | 2013-09-19 |
Traffic light Grant 8,459,838 - Liao , et al. June 11, 2 | 2013-06-11 |
Light emitting diode package and manufacturing method thereof Grant 8,344,406 - Hsieh , et al. January 1, 2 | 2013-01-01 |
Led Package Structure App 20120043576 - HSIEH; MIN-TSUN ;   et al. | 2012-02-23 |
Light Emitting Diode Light Bar App 20120020089 - HSIEH; MIN-TSUN ;   et al. | 2012-01-26 |
Fluorescent Structure And Method For Forming The Fluorescent Structure And Led Package Using The Same App 20110297981 - LIAO; CHI-WEI ;   et al. | 2011-12-08 |
Light-emitting Element Package And Fabrication Method Thereof App 20110291138 - HSIEH; MIN-TSUN ;   et al. | 2011-12-01 |
Led Package App 20110266574 - LIAO; CHI-WEI ;   et al. | 2011-11-03 |
Light Emitting Diode Package And Manufacturing Method Thereof App 20110266570 - HSIEH; MIN-TSUN ;   et al. | 2011-11-03 |
Traffic Light App 20110261562 - LIAO; CHI-WEI ;   et al. | 2011-10-27 |
LED light bar Grant D644,189 - Lin , et al. August 30, 2 | 2011-08-30 |
LED light bar Grant D642,994 - Lin , et al. August 9, 2 | 2011-08-09 |
LED light bar Grant D642,995 - Lin , et al. August 9, 2 | 2011-08-09 |
LED light bar Grant D642,545 - Lin , et al. August 2, 2 | 2011-08-02 |
LED light bar Grant D640,212 - Lin , et al. June 21, 2 | 2011-06-21 |
Light Emitting Diode And Package Method Thereof App 20090278152 - CHANG; CHIA CHEN ;   et al. | 2009-11-12 |
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