loadpatents
name:-0.047224044799805
name:-0.037693977355957
name:-0.015400886535645
Liang; Yao-Hsiang Patent Filings

Liang; Yao-Hsiang

Patent Applications and Registrations

Patent applications and USPTO patent grants for Liang; Yao-Hsiang.The latest application filed is for "electrochemical plating system and method of using".

Company Profile
14.35.41
  • Liang; Yao-Hsiang - Hsinchu TW
  • Liang; Yao-Hsiang - Shinchu TW
  • LIANG; Yao-Hsiang - Hsinchu City TW
  • Liang; Yao Hsiang - Hsin-Chu TW
  • Liang; Yao Hsiang - Kaohsiung TW
  • Liang, Yao-Hsiang - Kaohsiang TW
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Image sensing device and manufacturing method thereof
Grant 11,417,700 - Huang , et al. August 16, 2
2022-08-16
Method of forming deep trench isolation in radiation sensing substrate and image sensor device
Grant 11,404,470 - Lu , et al. August 2, 2
2022-08-02
Method of forming semiconductor device
Grant 11,387,274 - Lu , et al. July 12, 2
2022-07-12
Electrochemical Plating System And Method Of Using
App 20220042197 - Nian; Jun-Nan ;   et al.
2022-02-10
Semiconductor device structure with anti-acid layer and method for forming the same
Grant 11,158,659 - Chu , et al. October 26, 2
2021-10-26
Method For Controlling Electrochemical Deposition To Avoid Defects In Inerconnect Structures
App 20210238765 - NIAN; Jun-Nan ;   et al.
2021-08-05
Method for controlling electrochemical deposition to avoid defects in interconnect structures
Grant 11,015,260 - Nian , et al. May 25, 2
2021-05-25
Semiconductor Device And Method Of Forming The Same
App 20200402916 - LU; Chi-Ming ;   et al.
2020-12-24
Method of manufacturing semiconductor structure
Grant 10,867,889 - Fang , et al. December 15, 2
2020-12-15
Image Sensing Device And Manufacturing Method Thereof
App 20200373345 - HUANG; CHIH-CHANG ;   et al.
2020-11-26
Semiconductor device and method of forming the same
Grant 10,796,996 - Lu , et al. October 6, 2
2020-10-06
Image sensing device and manufacturing method thereof
Grant 10,741,601 - Huang , et al. A
2020-08-11
Method For Controlling Electrochemical Deposition To Avoid Defects In Inerconnect Structures
App 20200176310 - Nian; Jun-Nan ;   et al.
2020-06-04
Electrochemical Plating System And Method Of Using
App 20200173051 - Nian; Jun-Nan ;   et al.
2020-06-04
Method of Forming Deep Trench Isolation in Radiation Sensing Substrate and Image Sensor Device
App 20200119081 - LU; Chi-Ming ;   et al.
2020-04-16
Method of Forming Semiconductor Device
App 20200083278 - LU; Chi-Ming ;   et al.
2020-03-12
Method of forming deep trench isolation in radiation sensing substrate and image sensor device
Grant 10,510,798 - Lu , et al. Dec
2019-12-17
Semiconductor device having stress-neutralized film stack and method of fabricating same
Grant 10,475,847 - Lu , et al. Nov
2019-11-12
Image Sensing Device And Manufacturing Method Thereof
App 20190148442 - HUANG; CHIH-CHANG ;   et al.
2019-05-16
Method Of Forming Deep Trench Isolation In Radiation Sensing Substrate And Image Sensor Device
App 20190043915 - Lu; Chi-Ming ;   et al.
2019-02-07
Method Of Manufacturing Semiconductor Structure
App 20190019743 - FANG; LI-YEN ;   et al.
2019-01-17
Image sensing device and manufacturing method thereof
Grant 10,157,953 - Huang , et al. Dec
2018-12-18
Semiconductor Device Structure with Anti-Acid Layer and Method for Forming the Same
App 20180350855 - Chu; Yin-Shuo ;   et al.
2018-12-06
Method of forming deep trench isolation in radiation sensing substrate and image sensor device
Grant 10,134,801 - Lu , et al. November 20, 2
2018-11-20
Semiconductor Device And Method Of Forming The Same
App 20180261547 - LU; Chi-Ming ;   et al.
2018-09-13
Semiconductor structure and manufacturing method thereof
Grant 10,074,594 - Fang , et al. September 11, 2
2018-09-11
Through via structure for step coverage improvement
Grant 9,991,204 - Fang , et al. June 5, 2
2018-06-05
Method for forming interconnect structure
Grant 9,966,304 - Lin , et al. May 8, 2
2018-05-08
Method of manufacturing semiconductor device with recess
Grant 9,859,124 - Fang , et al. January 2, 2
2018-01-02
Method Of Forming Semiconductor Device
App 20170317134 - LU; Chi-Ming ;   et al.
2017-11-02
Image Sensing Device And Manufacturing Method Thereof
App 20170294473 - HUANG; CHIH-CHANG ;   et al.
2017-10-12
Through Via Structure For Step Coverage Improvement
App 20170287841 - FANG; Li-Yen ;   et al.
2017-10-05
Through via structure for step coverage improvement
Grant 9,711,454 - Fang , et al. July 18, 2
2017-07-18
Image sensing device and manufacturing method thereof
Grant 9,691,804 - Huang , et al. June 27, 2
2017-06-27
Semiconductor Device Structure With Anti-acid Layer And Method For Forming The Same
App 20170170215 - CHU; Yin-Shuo ;   et al.
2017-06-15
Method Of Forming Deep Trench Isolation In Radiation Sensing Substrate And Image Sensor Device
App 20170154917 - LU; Chi-Ming ;   et al.
2017-06-01
Semiconductor device with advanced pad structure resistant to plasma damage and metnod for forming same
Grant 9,666,545 - Wang , et al. May 30, 2
2017-05-30
Through Via Structure For Step Coverage Improvement
App 20170062343 - FANG; Li-Yen ;   et al.
2017-03-02
Method For Forming Interconnect Structure
App 20160379875 - LIN; Yu-Hung ;   et al.
2016-12-29
Semiconductor Device With Advanced Pad Structure Resistant To Plasma Damage And Metnod For Forming Same
App 20160315058 - WANG; Hung-Chih ;   et al.
2016-10-27
Semiconductor Structure And Manufacturing Method Thereof
App 20160307823 - FANG; LI-YEN ;   et al.
2016-10-20
Method Of Manufacturing Semiconductor Device With Recess
App 20160307761 - FANG; LI-YEN ;   et al.
2016-10-20
Image Sensing Device And Manufacturing Method Thereof
App 20160307952 - HUANG; CHIH-CHANG ;   et al.
2016-10-20
Semiconductor device with advanced pad structure resistant to plasma damage and method for forming the same
Grant 9,385,081 - Wang , et al. July 5, 2
2016-07-05
Insulation layer to improve capacitor breakdown voltage
Grant 9,196,674 - Liang November 24, 2
2015-11-24
Semiconductor Device With Advanced Pad Structure Resistant To Plasma Damage And Method For Forming The Same
App 20150179565 - WANG; Hung-Chih ;   et al.
2015-06-25
Barrier layer for copper interconnect
Grant 9,064,934 - Lin , et al. June 23, 2
2015-06-23
Semiconductor device with advanced pad structure resistant to plasma damage and method for forming the same
Grant 9,006,900 - Wang , et al. April 14, 2
2015-04-14
Barrier Layer for Copper Interconnect
App 20150044867 - Lin; Yu-Hung ;   et al.
2015-02-12
Interconnect Structure and Method for Forming Interconnect Structure
App 20150001720 - Lin; Yu-Hung ;   et al.
2015-01-01
Barrier layer for copper interconnect
Grant 8,872,342 - Lin , et al. October 28, 2
2014-10-28
Metal Capping Layer for Interconnect Applications
App 20140264872 - Lin; Yu-Hung ;   et al.
2014-09-18
Semiconductor Device With Advanced Pad Structure Resistant To Plasma Damage And Method For Forming The Same
App 20140252623 - WANG; Hung-Chih ;   et al.
2014-09-11
Insulation Layer to Improve Capacitor Breakdown Voltage
App 20140242774 - Liang; Yao Hsiang
2014-08-28
Method for forming seed layer structure
Grant 8,778,801 - Chiang , et al. July 15, 2
2014-07-15
Barrier Layer for Copper Interconnect
App 20140191402 - Lin; Yu-Hung ;   et al.
2014-07-10
Insulation layer to improve capacitor breakdown voltage
Grant 8,742,540 - Liang June 3, 2
2014-06-03
Barrier layer for copper interconnect
Grant 8,722,531 - Lin , et al. May 13, 2
2014-05-13
Barrier Layer For Copper Interconnect
App 20140117547 - Lin; Yu-Hung ;   et al.
2014-05-01
Seed Layer Structure and Method
App 20140084470 - Chiang; Chen-Bin ;   et al.
2014-03-27
Method and apparatus for back end of line semiconductor device processing
Grant 8,673,765 - Wang , et al. March 18, 2
2014-03-18
Method and Apparatus for Back End of Line Semiconductor Device Processing
App 20130320539 - Wang; Hung-Chih ;   et al.
2013-12-05
Image sensor having an RPO layer containing nitrogen
Grant 7,772,625 - Liang , et al. August 10, 2
2010-08-10
Image Sensors And Methods Of Fabricating Image Sensors
App 20080083938 - Liang; Yao Hsiang ;   et al.
2008-04-10
Insulation layer to improve capacitor breakdown voltage
App 20070045702 - Liang; Yao Hsiang
2007-03-01
Apparatus and method for transferring a torque from a rotating hub frame to a one-piece hub shaft
Grant 6,783,441 - Liang , et al. August 31, 2
2004-08-31
Contamination prevention system and method
Grant 6,672,950 - Peng , et al. January 6, 2
2004-01-06
Contamination prevention system and method
App 20030143937 - Peng, Chih-I ;   et al.
2003-07-31
Apparatus For Holding Wafer Cassettes In A Cassette In A Cassette Tub During A Chemical Mechanical Polishing Process
App 20030119434 - Lai, Kevin ;   et al.
2003-06-26
Wafer blade for wafer pick-up from a water tank and method for using
Grant 6,561,744 - Liang May 13, 2
2003-05-13
Wafer blade for wafer pick-up from a water tank and method for using
App 20030031544 - Liang, Yao Hsiang
2003-02-13
Apparatus and method for transferring a torque from a rotating hub frame to a one-piece hub shaft
App 20030032374 - Liang, Yao Hsiang ;   et al.
2003-02-13
Conformal disk holder for CMP pad conditioner
Grant 6,394,886 - Chen , et al. May 28, 2
2002-05-28

uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.

While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.

All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.

© 2024 USPTO.report | Privacy Policy | Resources | RSS Feed of Trademarks | Trademark Filings Twitter Feed