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Patent applications and USPTO patent grants for Liang; Wei-Wei.The latest application filed is for "chemical mechanical polishing slurry composition, method for chemical mechanical polishing and method for forming connecting structure".
Patent | Date |
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Ion implant process for defect elimination in metal layer planarization Grant 11,450,565 - Chen , et al. September 20, 2 | 2022-09-20 |
Methods For Chemical Mechanical Polishing And Forming Interconnect Structure App 20210391186 - Cui; Ji ;   et al. | 2021-12-16 |
Chemical Mechanical Polishing Slurry Composition, Method For Chemical Mechanical Polishing And Method For Forming Connecting Structure App 20210391208 - Cui; Ji ;   et al. | 2021-12-16 |
Slurry Composition And Method For Polishing And Integratged Circuit App 20210371702 - CUI; JI ;   et al. | 2021-12-02 |
Ion Implant Process For Defect Elimination In Metal Layer Planarization App 20210305092 - CHEN; Chia-Cheng ;   et al. | 2021-09-30 |
Chemical mechanical polishing slurry and chemical mechanical polishing process using the same Grant 10,858,544 - Liang December 8, 2 | 2020-12-08 |
Chemical Mechanical Polishing Slurry And Chemical Mechanical Polishing Process Using The Same App 20190359859 - LIANG; WEI-WEI | 2019-11-28 |
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