Liang; Steve Xin

Patent Applications and Registrations

Patent applications and USPTO patent grants for Liang; Steve Xin.The latest application filed is for "etching-before-packaging horizontal chip 3d system-level metal circuit board structure and technique thereof".

Company Profile

0.4.6

Liang; Steve Xin - Jiangsu CN
Liang; Steve Xin - San Diego CA US

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Etching-before-packaging horizontal chip 3D system-level metal circuit board structure and technique thereof Grant 9,640,413 - Liang , et al. May 2, 2	2017-05-02
Etching-before-packaging Horizontal Chip 3d System-level Metal Circuit Board Structure And Technique Thereof App 20160372338 - Liang; Steve Xin ; et al.	2016-12-22
Packaging-before-etching Flip Chip 3d System-level Metal Circuit Board Structure And Technique Thereof App 20160163622 - Liang; Steve Xin ; et al.	2016-06-09
First-packaged And Later-etched Three-dimensional Flip-chip System-in-package Structure And Processing Method Therefor App 20160148861 - Liang; Chih-Chung ; et al.	2016-05-26
First-packaged And Later-etched Normal Chip Three Dimension System-in-package Metal Circuit Board Structure And Processing Method Thereof App 20160141233 - Liang; Steve Xin ; et al.	2016-05-19
In-situ cavity integrated circuit package Grant 8,900,931 - Liang December 2, 2	2014-12-02
In-situ Cavity Circuit Package App 20100283144 - Liang; Steve Xin	2010-11-11
Thermal mechanical flip chip die bonding Grant 7,642,135 - Liang January 5, 2	2010-01-05
Thermal Mechanical Flip Chip Die Bonding App 20090155955 - Liang; Steve Xin	2009-06-18

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