Liang; Steve X.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Liang; Steve X..The latest application filed is for "integrated circuit package including in-situ formed cavity".
- Liang; Steve X. - San Diego CA
| Patent | Date |
|---|---|
| Integrated circuit package including in-situ formed cavity Grant 9,153,551 - Liang October 6, 2 | 2015-10-06 |
| Integrated Circuit Package Including In-situ Formed Cavity App 20150061125 - Liang; Steve X. | 2015-03-05 |
| Method for fabricating a wafer level package with device wafer and passive component integration Grant 7,629,201 - Gan , et al. December 8, 2 | 2009-12-08 |
| Wafer level package including a device wafer integrated with a passive component Grant 7,576,426 - Gan , et al. August 18, 2 | 2009-08-18 |
| Integrated passive cap in a system-in-package App 20080217708 - Reisner; Russ ; et al. | 2008-09-11 |
| Method for fabricating a wafer level package with device wafer and passive component integration App 20080003761 - Gan; Qing ; et al. | 2008-01-03 |
| Packaged electronic devices and process of manufacturing same App 20070070608 - Warren; Robert W. ; et al. | 2007-03-29 |
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