LIANG; Shuen-Shin
Patent Applications and Registrations
Patent applications and USPTO patent grants for LIANG; Shuen-Shin.The latest application filed is for "air spacer formation with a spin-on dielectric material".
- LIANG; Shuen-Shin - Hsinchu TW
- Liang; Shuen-Shin - Hsinchu County TW
- Liang; Shuen-Shin - Hsinchu City TW
| Patent | Date |
|---|---|
| Air Spacer Formation With A Spin-on Dielectric Material App 20220285492 - CHEN; Ting-Ting ; et al. | 2022-09-08 |
| Conductive Feature Of Semiconductor Device And Method Of Forming Same App 20220277994 - Lai; Bo-Yu ; et al. | 2022-09-01 |
| Semiconductor device and manufacturing method thereof Grant 11,424,185 - Chang , et al. August 23, 2 | 2022-08-23 |
| Structure and formation method of semiconductor device with high contact area Grant 11,393,924 - Liang , et al. July 19, 2 | 2022-07-19 |
| Seal Material For Air Gaps In Semiconductor Devices App 20220223686 - Liang; Shuen-Shin ; et al. | 2022-07-14 |
| Integrated circuit isolation feature and method of forming the same Grant 11,387,138 - Peng , et al. July 12, 2 | 2022-07-12 |
| Self-aligned Barrier For Metal Vias App 20220139773 - WANG; Sung-Li ; et al. | 2022-05-05 |
| Interconnect Structure And Manufacturing Method For The Same App 20220130755 - LIANG; SHUEN-SHIN ; et al. | 2022-04-28 |
| Method And Structure For Barrier-less Plug App 20220108919 - Wang; Sung-Li ; et al. | 2022-04-07 |
| Seal material for air gaps in semiconductor devices Grant 11,296,187 - Liang , et al. April 5, 2 | 2022-04-05 |
| Dual Side Contact Structures in Semiconductor Devices App 20220052157 - CHANG; Cheng-Wei ; et al. | 2022-02-17 |
| Contact Structures In Semiconductor Devices App 20220045188 - Chang; Hsu-Kai ; et al. | 2022-02-10 |
| Method for making self-aligned barrier for metal vias In-Situ during a metal halide pre-clean and associated interconnect structure Grant 11,227,794 - Wang , et al. January 18, 2 | 2022-01-18 |
| Interconnect structure and manufacturing method for the same Grant 11,217,524 - Liang , et al. January 4, 2 | 2022-01-04 |
| Tunable Low-k Inner Air Spacers Of Semiconductor Devices App 20210407856 - Wang; Chen-Han ; et al. | 2021-12-30 |
| Hybrid Conductive Structures App 20210407925 - CHANG; Cheng-Wei ; et al. | 2021-12-30 |
| Epitaxial Backside Contact App 20210399099 - Chu; Chia-Hung ; et al. | 2021-12-23 |
| Interconnect Structure And Manufacturing Method For The Same App 20210391252 - LIANG; SHUEN-SHIN ; et al. | 2021-12-16 |
| Liner-free Conductive Structures App 20210376103 - LIANG; Shuen-Shin ; et al. | 2021-12-02 |
| Structure And Formation Method Of Semiconductor Device With High Contact Area App 20210359125 - LIANG; Shuen-Shin ; et al. | 2021-11-18 |
| Capping Layer For Liner-free Conductive Structures App 20210335720 - LIANG; Shuen-Shin ; et al. | 2021-10-28 |
| Method and structure for barrier-less plug Grant 11,158,539 - Wang , et al. October 26, 2 | 2021-10-26 |
| Liner-Free Conductive Structures with Anchor Points App 20210233861 - Chang; Hsu-Kai ; et al. | 2021-07-29 |
| Semiconductor Device And Manufacturing Method Thereof App 20210202399 - CHANG; Cheng-Wei ; et al. | 2021-07-01 |
| Seal Material For Air Gaps In Semiconductor Devices App 20210193799 - LIANG; Shuen-Shin ; et al. | 2021-06-24 |
| Bilayer Seal Material For Air Gaps In Semiconductor Devices App 20210193506 - LIANG; Shuen-Shin ; et al. | 2021-06-24 |
| Seal Material For Air Gaps In Semiconductor Devices App 20210193798 - Liang; Shuen-Shin ; et al. | 2021-06-24 |
| Method For Making Self-aligned Barrier For Metal Vias App 20210193511 - WANG; Sung-Li ; et al. | 2021-06-24 |
| Interconnect structures and methods of forming the same Grant 11,011,413 - Wang , et al. May 18, 2 | 2021-05-18 |
| Method and Structure for Barrier-Less Plug App 20210098295 - Wang; Sung-Li ; et al. | 2021-04-01 |
| Semiconductor Device And Methods Of Forming The Same App 20200273794 - Khaderbad; Mrunal A. ; et al. | 2020-08-27 |
| Conductive Structure Formed By Cyclic Chemical Vapor Deposition App 20200273695 - KHADERBAD; Mrunal A. ; et al. | 2020-08-27 |
| Integrated Circuit Dielectric Material App 20200098616 - Peng; Chih-Tang ; et al. | 2020-03-26 |
| Interconnect Structures and Methods of Forming the Same App 20190214296 - Wang; Sung-Li ; et al. | 2019-07-11 |
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