Liang; Shih-Wei

Patent Applications and Registrations

Patent applications and USPTO patent grants for Liang; Shih-Wei.The latest application filed is for "barrier structures between external electrical connectors".

Company Profile

19.83.84

Liang; Shih-Wei - Dajia Township TW
Liang; Shih Wei - Taichung City TW
Liang; Shih Wei - Taichung TW
Liang; Shih-Wei - Taichung County TW
Liang; Shih-Wei - Daijia Township TW
Liang; Shih-Wei - Hsin-Chu TW
Liang; Shih-Wei - Daija Township TW
- Taichung County TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Polymer layers embedded with metal pads for heat dissipation Grant 11,398,440 - Chuang , et al. July 26, 2	2022-07-26
Barrier Structures Between External Electrical Connectors App 20220230940 - Miao; Chia-Chun ; et al.	2022-07-21
Methods and apparatus for package on package devices Grant RE49,046 - Liu , et al. April 19, 2	2022-04-19
Barrier structures between external electrical connectors Grant 11,296,012 - Miao , et al. April 5, 2	2022-04-05
Techniques For Forming Semiconductor Device Packages And Related Packages, Intermediate Products, And Methods App 20220037282 - Yang; Po Chih ; et al.	2022-02-03
Methods and Apparatus for Package with Interposers App 20210391230 - Lu; Chun-Lin ; et al.	2021-12-16
Techniques for forming semiconductor device packages and related packages, intermediate products, and methods Grant 11,171,109 - Yang , et al. November 9, 2	2021-11-09
Methods and apparatus for package with interposers Grant 11,114,357 - Lu , et al. September 7, 2	2021-09-07
Surface mounting semiconductor components Grant 11,101,238 - Liu , et al. August 24, 2	2021-08-24
Semiconductor Device And Manufacturing Method Thereof App 20210210450 - LU; CHUN-LIN ; et al.	2021-07-08
Solder ball protection in packages Grant 10,985,117 - Miao , et al. April 20, 2	2021-04-20
Interconnection structure including a metal post encapsulated by a joint material having concave outer surface Grant 10,971,463 - Lu , et al. April 6, 2	2021-04-06
Techniques For Forming Semiconductor Device Packages And Related Packages, Intermediate Products, And Methods App 20210091036 - Yang; Po Chih ; et al.	2021-03-25
Mechanisms for forming hybrid bonding structures with elongated bumps Grant 10,867,957 - Lu , et al. December 15, 2	2020-12-15
Solder Ball Protection in Packages App 20200118947 - Miao; Chia-Chun ; et al.	2020-04-16
Dual-mode Wireless Charging Device App 20200066635 - LIANG; Shih-Wei ; et al.	2020-02-27
Methods and Apparatus for Package with Interposers App 20200027803 - Lu; Chun-Lin ; et al.	2020-01-23
Methods and apparatus for package with interposers Grant 10,522,437 - Lu , et al. Dec	2019-12-31
Solder ball protection in packages Grant 10,510,689 - Miao , et al. Dec	2019-12-17
Dual-mode wireless charging device Grant 10,497,646 - Liang , et al. De	2019-12-03
Barrier Structures Between External Electrical Connectors App 20190333841 - Miao; Chia-Chun ; et al.	2019-10-31
Barrier structures between external electrical connectors Grant 10,347,563 - Miao , et al. July 9, 2	2019-07-09
Manufacturing method of semiconductor package Grant 10,312,209 - Shih , et al.	2019-06-04
Mechanisms for Forming Hybrid Bonding Structures with Elongated Bumps App 20190123017 - Lu; Chun-Lin ; et al.	2019-04-25
Method for manufacturing semiconductor structure Grant 10,269,737 - Huang , et al.	2019-04-23
Integrated circuit underfill scheme Grant 10,269,588 - Liang , et al.	2019-04-23
Polymer Layers Embedded with Metal Pads for Heat Dissipation App 20190057946 - Chuang; Hao-Hsiang ; et al.	2019-02-21
Mechanisms for forming hybrid bonding structures with elongated bumps Grant 10,163,846 - Lu , et al. Dec	2018-12-25
Semiconductor structure and manufacturing method thereof Grant 10,157,900 - Liang , et al. Dec	2018-12-18
Solder Ball Protection in Packages App 20180337144 - Miao; Chia-Chun ; et al.	2018-11-22
Polymer layers embedded with metal pads for heat dissipation Grant 10,109,605 - Chuang , et al. October 23, 2	2018-10-23
Packaging devices and methods Grant 10,079,200 - Liang , et al. September 18, 2	2018-09-18
Semicondcutor structure and semiconductor manufacturing process thereof Grant 10,062,654 - Lai , et al. August 28, 2	2018-08-28
Methods and Apparatus for Package with Interposers App 20180240723 - Lu; Chun-Lin ; et al.	2018-08-23
Manufacturing Method Of Semiconductor Package App 20180233472 - SHIH; CHAO-WEN ; et al.	2018-08-16
Solder ball protection in packages Grant 10,049,990 - Miao , et al. August 14, 2	2018-08-14
Semiconductor structure and manufacturing method thereof Grant 10,037,959 - Miao , et al. July 31, 2	2018-07-31
Surface Mounting Semiconductor Components App 20180211935 - LIU; MING-KAI ; et al.	2018-07-26
Semiconductor devices with ball strength improvement Grant 9,978,704 - Yu , et al. May 22, 2	2018-05-22
Methods and apparatus for package with interposers Grant 9,966,321 - Lu , et al. May 8, 2	2018-05-08
Semiconductor packaging and manufacturing method thereof Grant 9,953,942 - Shih , et al. April 24, 2	2018-04-24
Semiconductor device and method of forming the same Grant 9,953,966 - Miao , et al. April 24, 2	2018-04-24
Optical sensing system and associated electronic device Grant 9,943,239 - Kuo , et al. April 17, 2	2018-04-17
Semiconductor chip scale package and manufacturing method thereof Grant 9,941,240 - Liu , et al. April 10, 2	2018-04-10
Semiconductor Device And Manufacturing Method Thereof App 20180061798 - LU; CHUN-LIN ; et al.	2018-03-01
Method For Manufacturing Semiconductor Structure App 20180033750 - HUANG; CHANG-PIN ; et al.	2018-02-01
Dual-mode Wireless Charging Device App 20180033725 - LIANG; Shih-Wei ; et al.	2018-02-01
Semicondcutor Structure And Semiconductor Manufacturing Process Thereof App 20180025997 - Lai; Yu-Chia ; et al.	2018-01-25
Conductive Terminal On Integrated Circuit App 20170372999 - Lai; Yu-Chia ; et al.	2017-12-28
Conductive terminal on integrated circuit Grant 9,852,985 - Lai , et al. December 26, 2	2017-12-26
Interconnection structure including a metal post encapsulated by solder joint having a concave outer surface Grant 9,806,045 - Lu , et al. October 31, 2	2017-10-31
Package structures having height-adjusted molding members and methods of forming the same Grant 9,799,615 - Huang , et al. October 24, 2	2017-10-24
Semiconductor structure and manufacturing method thereof Grant 9,786,618 - Huang , et al. October 10, 2	2017-10-10
Barrier Structures Between External Electrical Connectors App 20170256477 - Miao; Chia-Chun ; et al.	2017-09-07
Optical Sensing System And Associated Electronic Device App 20170251937 - KUO; HUNG-YI ; et al.	2017-09-07
Packaging Devices and Methods App 20170250129 - Liang; Shih-Wei ; et al.	2017-08-31
Shadow pad for post-passivation interconnect structures Grant 9,748,212 - Liang , et al. August 29, 2	2017-08-29
Electrical connections for chip scale packaging Grant 9,741,659 - Chen , et al. August 22, 2	2017-08-22
Barrier structures between external electrical connectors Grant 9,698,079 - Miao , et al. July 4, 2	2017-07-04
Mechanisms for Forming Hybrid Bonding Structures with Elongated Bumps App 20170141073 - Lu; Chun-Lin ; et al.	2017-05-18
Semiconductor Structure And Manufacturing Method Thereof App 20170141056 - HUANG; CHANG-PIN ; et al.	2017-05-18
Semiconductor structure and manufacturing method thereof Grant 9,653,341 - Miao , et al. May 16, 2	2017-05-16
Packaging devices and methods Grant 9,653,418 - Liang , et al. May 16, 2	2017-05-16
Integrated circuit with test circuit Grant 9,646,954 - Liang , et al. May 9, 2	2017-05-09
Integrated Fan-out (info) Package Structures And Methods Of Forming Same App 20170110425 - Huang; Chang-Pin ; et al.	2017-04-20
Package alignment structure and method of forming same Grant 9,627,325 - Liu , et al. April 18, 2	2017-04-18
Integrated circuit structure and seal ring structure Grant 9,627,332 - Liang , et al. April 18, 2	2017-04-18
Semiconductor Structure and Manufacturing Method Thereof App 20170098640 - Liang; Shih-Wei ; et al.	2017-04-06
Semiconductor Packaging And Manufacturing Method Thereof App 20170062369 - SHIH; CHAO-WEN ; et al.	2017-03-02
Methods and Apparatus for Package with Interposers App 20170047261 - Lu; Chun-Lin ; et al.	2017-02-16
Mechanisms for forming hybrid bonding structures with elongated bumps Grant 9,559,071 - Lu , et al. January 31, 2	2017-01-31
Semiconductor Structure And Manufacturing Method Thereof App 20170018519 - MIAO; CHIA-CHUN ; et al.	2017-01-19
Semiconductor packaging and manufacturing method thereof Grant 9,543,263 - Shih , et al. January 10, 2	2017-01-10
Semiconductor structure and manufacturing method thereof Grant 9,543,373 - Liang , et al. January 10, 2	2017-01-10
Semiconductor Devices With Ball Strength Improvement App 20160372435 - Yu; Tsung-Yuan ; et al.	2016-12-22
Methods and apparatus for package with interposers Grant 9,497,861 - Lu , et al. November 15, 2	2016-11-15
Interconnect Structures, Packaged Semiconductor Devices, and Methods of Packaging Semiconductor Devices App 20160322337 - Liang; Shih-Wei ; et al.	2016-11-03
Semiconductor structure and manufacturing method thereof Grant 9,472,523 - Miao , et al. October 18, 2	2016-10-18
Interposer having a defined through via pattern Grant 9,460,989 - Liang , et al. October 4, 2	2016-10-04
MIM capacitor and method forming the same Grant 9,461,106 - Yang , et al. October 4, 2	2016-10-04
MIM Capacitor and Method Forming the Same App 20160276426 - Yang; Ching-Jung ; et al.	2016-09-22
Semiconductor devices with ball strength improvement Grant 9,437,567 - Yu , et al. September 6, 2	2016-09-06
Integrated Circuit Underfill Scheme App 20160254169 - Liang; Shih-Wei ; et al.	2016-09-01
Semiconductor device having trench adjacent to receiving area and method of forming the same Grant 9,397,056 - Wang , et al. July 19, 2	2016-07-19
Methods and apparatus for package on package devices Grant 9,373,599 - Liu , et al. June 21, 2	2016-06-21
Integrated circuit underfill scheme Grant 9,355,924 - Liang , et al. May 31, 2	2016-05-31
Semiconductor Device And Method Of Forming The Same App 20160133618 - MIAO; CHIA-CHUN ; et al.	2016-05-12
Chip package and method of manufacturing the same Grant 9,337,117 - Yang , et al. May 10, 2	2016-05-10
Semiconductor device and method of manufacturing the same Grant 9,337,154 - Miao , et al. May 10, 2	2016-05-10
Electrical Connections for Chip Scale Packaging App 20160111363 - Chen; Hsien-Wei ; et al.	2016-04-21
Semiconductor Device And Method Of Manufacturing The Same App 20160064338 - MIAO; CHIA-CHUN ; et al.	2016-03-03
Semiconductor device Grant 9,263,405 - Miao , et al. February 16, 2	2016-02-16
Electrical connections for chip scale packaging Grant 9,224,680 - Chen , et al. December 29, 2	2015-12-29
Semiconductor Device Having Trench Adjacent To Receiving Area And Method Of Forming The Same App 20150348923 - WANG; YEN-PING ; et al.	2015-12-03
Semiconductor device with bump adjustment and manufacturing method thereof Grant 9,184,143 - Miao , et al. November 10, 2	2015-11-10
Polymer Layers Embedded With Metal Pads for Heat Dissipation App 20150311169 - Chuang; Hao-Hsiang ; et al.	2015-10-29
Semiconductor Structure And Manufacturing Method Thereof App 20150255273 - MIAO; CHIA-CHUN ; et al.	2015-09-10
Solder Ball Protection In Packages App 20150255406 - Miao; Chia-Chun ; et al.	2015-09-10
Packaging Devices and Methods App 20150243615 - Liang; Shih-Wei ; et al.	2015-08-27
Chip Package And Method Of Manufacturing The Same App 20150206817 - YANG; Chung-Ying ; et al.	2015-07-23
Semiconductor Structure And Manufacturing Method Thereof App 20150200173 - MIAO; CHIA-CHUN ; et al.	2015-07-16
Polymer layers embedded with metal pads for heat dissipation Grant 9,082,761 - Chuang , et al. July 14, 2	2015-07-14
Barrier Structures Between External Electrical Connectors App 20150194400 - Miao; Chia-Chun ; et al.	2015-07-09
Singulated semiconductor structure Grant 9,064,873 - Miao , et al. June 23, 2	2015-06-23
Semiconductor Device And Method Of Forming The Same App 20150162291 - MIAO; CHIA-CHUN ; et al.	2015-06-11
Semiconductor Device And Method Of Forming The Same App 20150162288 - MIAO; CHIA-CHUN ; et al.	2015-06-11
Semiconductor Packaging And Manufacturing Method Thereof App 20150130020 - SHIH; CHAO-WEN ; et al.	2015-05-14
Packaging devices and methods Grant 9,030,010 - Liang , et al. May 12, 2	2015-05-12
Semiconductor Structure And Manufacturing Method Thereof App 20150108635 - LIANG; SHIH-WEI ; et al.	2015-04-23
Method of making a semiconductor device having a post-passivation interconnect structure Grant 9,006,891 - Liang , et al. April 14, 2	2015-04-14
Electrical Connections for Chip Scale Packaging App 20150097287 - Chen; Hsien-Wei ; et al.	2015-04-09
Bond pad structure to reduce bond pad corrosion Grant 8,994,181 - Chen , et al. March 31, 2	2015-03-31
Methods and Apparatus for Package on Package Devices App 20150069606 - Liu; Ming-Kai ; et al.	2015-03-12
Semiconductor Device And Manufacturing Method Thereof App 20150061116 - LU; CHUN-LIN ; et al.	2015-03-05
Chip package and method of manufacturing the same Grant 8,957,503 - Yang , et al. February 17, 2	2015-02-17
Semiconductor Device And Manufacturing Method Thereof App 20150035161 - MIAO; CHIA-CHUN ; et al.	2015-02-05
Semiconductor Devices With Ball Strength Improvement App 20150028481 - YU; Tsung-Yuan ; et al.	2015-01-29
Semiconductor Device And Manufacturing Method Thereof App 20150008575 - LIU; MING-KAI ; et al.	2015-01-08
Mechanisms For Forming Hybrid Bonding Structures With Elongated Bumps App 20150001704 - LU; Chun-Lin ; et al.	2015-01-01
UBM structures for wafer level chip scale packaging Grant 8,916,465 - Yu , et al. December 23, 2	2014-12-23
Electrical connections for chip scale packaging Grant 8,912,668 - Chen , et al. December 16, 2	2014-12-16
Polymer Layers Embedded with Metal Pads for Heat Dissipation App 20140353819 - Chuang; Hao-Hsiang ; et al.	2014-12-04
Methods and apparatus for package on package devices Grant 8,901,730 - Liu , et al. December 2, 2	2014-12-02
Methods of and semiconductor devices with ball strength improvement Grant 8,871,629 - Yu , et al. October 28, 2	2014-10-28
Package Alignment Structure and Method of Forming Same App 20140252657 - Liu; Ming-Kai ; et al.	2014-09-11
UBM Structures for Wafer Level Chip Scale Packaging App 20140170850 - Yu; Tsung-Yuan ; et al.	2014-06-19
Interposer Having a Defined Through Via Pattern App 20140162405 - Liang; Shih-Wei ; et al.	2014-06-12
Methods and Apparatus for Package with Interposers App 20140160688 - Lu; Chun-Lin ; et al.	2014-06-12
Integrated Circuit Underfill Scheme App 20140117555 - Liang; Shih-Wei ; et al.	2014-05-01
UBM structures for wafer level chip scale packaging Grant 8,692,378 - Yu , et al. April 8, 2	2014-04-08
Chip Package And Method Of Manufacturing The Same App 20140091437 - YANG; Chung-Ying ; et al.	2014-04-03
Packaging Devices and Methods App 20140077369 - Liang; Shih-Wei ; et al.	2014-03-20
Interposer having a defined through via pattern Grant 8,664,768 - Liang , et al. March 4, 2	2014-03-04
Method Of Making A Semiconductor Device Having A Post-passivation Interconnect Structure App 20140045326 - LIANG; Shih-Wei ; et al.	2014-02-13
Wafer level chip scale package and method of manufacturing the same Grant 8,624,359 - Yang , et al. January 7, 2	2014-01-07
Measurement of electrical and mechanical characteristics of low-K dielectric in a semiconductor device Grant 08618827 -	2013-12-31
Measurement of electrical and mechanical characteristics of low-K dielectric in a semiconductor device Grant 8,618,827 - Shao , et al. December 31, 2	2013-12-31
Post-passivation interconnect structure Grant 8,581,400 - Liang , et al. November 12, 2	2013-11-12
Methods and Apparatus for Package on Package Devices App 20130292831 - Liu; Ming-Kai ; et al.	2013-11-07
Interposer Having a Defined Through Via Pattern App 20130292830 - Liang; Shih-Wei ; et al.	2013-11-07
Electrical Connections for Chip Scale Packaging App 20130228897 - Chen; Hsien-Wei ; et al.	2013-09-05
UBM Structures for Wafer Level Chip Scale Packaging App 20130140706 - Yu; Tsung-Yuan ; et al.	2013-06-06
Methods Of And Semiconductor Devices With Ball Strength Improvement App 20130113097 - YU; Tsung-Yuan ; et al.	2013-05-09
Post-passivation Interconnect Structure App 20130093077 - LIANG; Shih-Wei ; et al.	2013-04-18
Wafer Level Chip Scale Package And Method Of Manufacturing The Same App 20130087914 - YANG; Chung-Ying ; et al.	2013-04-11
Bond Pad Structure To Reduce Bond Pad Corrosion App 20130043598 - CHEN; Ying-Ju ; et al.	2013-02-21
Integrated Circuit With Test Circuit App 20120261662 - LIANG; Shih-Wei ; et al.	2012-10-18
Probe pad on a corner stress relief region in a semiconductor chip Grant 8,237,160 - Chen , et al. August 7, 2	2012-08-07
Measurement Of Electrical And Mechanical Characteristics Of Low-k Dielectric In A Semiconductor Device App 20120092033 - Shao; Tung-Liang ; et al.	2012-04-19
Probe Pad On A Corner Stress Relief Region In A Semiconductor Chip App 20110284843 - Chen; Hsien-Wei ; et al.	2011-11-24