Liang; Ming-Shuoh
Patent Applications and Registrations
Patent applications and USPTO patent grants for Liang; Ming-Shuoh.The latest application filed is for "interconnect structure and method of forming the same".
- Liang; Ming-Shuoh - Kaohsiung TW
- LIANG; Ming-Shuoh - Kaohsiung City TW
- Liang; Ming-Shuoh - Hsin-Chu TW
- Liang, Ming-Shuoh - Hsinchu TW
| Patent | Date |
|---|---|
| Interconnect structure and method of forming the same Grant 11,348,828 - Cheng , et al. May 31, 2 | 2022-05-31 |
| Methods of fabricating integrated circuit devices having reduced line end spaces Grant 10,522,396 - Cheng , et al. Dec | 2019-12-31 |
| Interconnect Structure And Method Of Forming The Same App 20190157139 - CHENG; Jye-Yen ; et al. | 2019-05-23 |
| Seal ring structure for integrated circuit chips Grant 7,777,338 - Yao , et al. August 17, 2 | 2010-08-17 |
| Seal ring structure for integrated circuit chips App 20060055007 - Yao; Chih-Hsiang ; et al. | 2006-03-16 |
| Test pad for reducing die sawing damage App 20050230005 - Liang, Ming-Shuoh ; et al. | 2005-10-20 |
| Method of providing via in a multilayer semiconductor device App 20040262762 - Liang, Ming-Shuoh ; et al. | 2004-12-30 |
| Seal ring and die corner stress relief pattern design to protect against moisture and metallic impurities App 20040002198 - Lee, Tze-Liang ; et al. | 2004-01-01 |
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