| Patent | Date |
|---|
First-order authentication system
Grant 6,603,871 - Liang August 5, 2 | 2003-08-05 |
Portable authentication fluorescence scanner employing single and multiple illumination sources
App 20030080193 - Ryan, William J. ; et al. | 2003-05-01 |
Apparatus and methods for authentication using partially fluorescent graphic images and OCR characters
Grant 6,373,965 - Liang April 16, 2 | 2002-04-16 |
First-order authentication system
App 20010054644 - Liang, Louis H. | 2001-12-27 |
First-order authentication system
App 20010014169 - Liang, Louis H. | 2001-08-16 |
Apparatus and methods for fluorescent imaging and optical character reading
Grant 5,867,586 - Liang February 2, 1 | 1999-02-02 |
Apparatus and methods for fluorescent imaging and optical character reading
Grant 5,719,948 - Liang February 17, 1 | 1998-02-17 |
Fluorescence authentication reader with coaxial optics
Grant 5,666,417 - Liang , et al. September 9, 1 | 1997-09-09 |
Fluorescence authentication reader with coaxial optics
Grant 5,574,790 - Liang , et al. November 12, 1 | 1996-11-12 |
Methods and apparatus for authenticating data storage articles
Grant 5,548,106 - Liang , et al. August 20, 1 | 1996-08-20 |
Methods and apparatus for test and burn-in of integrated circuit devices
Grant 5,532,612 - Liang July 2, 1 | 1996-07-02 |
Apparatus for thermally coupling a heat sink to a leadframe
Grant 5,442,234 - Liang August 15, 1 | 1995-08-15 |
Integrated circuit package using a multi-layer PCB in a plastic package
Grant 5,420,758 - Liang May 30, 1 | 1995-05-30 |
Authentication system and method
Grant 5,418,855 - Liang , et al. May 23, 1 | 1995-05-23 |
Apparatus and method for calibration of fluorescence detectors
Grant 5,414,258 - Liang May 9, 1 | 1995-05-09 |
Semi-conductor device interconnect package assembly for improved package performance
Grant 5,414,299 - Wang , et al. May 9, 1 | 1995-05-09 |
Apparatus and method for thermally coupling a heat sink to a lead frame
Grant 5,387,554 - Liang February 7, 1 | 1995-02-07 |
Apparatus for thermally coupling a heat sink to a lead frame
Grant 5,378,924 - Liang January 3, 1 | 1995-01-03 |
Integrated circuit package design having an intermediate die-attach substrate bonded to a leadframe
Grant 5,365,409 - Kwon , et al. November 15, 1 | 1994-11-15 |
Lead frame assembly and method for wiring same
Grant 5,359,227 - Liang , et al. October 25, 1 | 1994-10-25 |
Design and sealing method for semiconductor packages
Grant 5,350,713 - Liang September 27, 1 | 1994-09-27 |
Lead frame assembly and method for wiring same
Grant 5,296,744 - Liang , et al. March 22, 1 | 1994-03-22 |
Integrated circuit die-to-leadframe interconnect assembly system
Grant 5,233,131 - Liang , et al. August 3, 1 | 1993-08-03 |
Method of constructing termination electrodes on yielded semiconductor die by visibly aligning the die pads through a transparent substrate
Grant 5,171,712 - Wang , et al. December 15, 1 | 1992-12-15 |
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