Liang; Le
Patent Applications and Registrations
Patent applications and USPTO patent grants for Liang; Le.The latest application filed is for "communication devices and methods based on markov-chain monte-carlo (mcmc) sampling".
Company Profile
21.21.28
- Liang; Le - Shanghai CN
- Liang; Le - Hillsboro OR
- LIANG; Le - Xi'an CN
- LIANG; Le - Taoyuan City CN
- Liang; Le - Taoyuan CN
- Liang; Le - Taiwan CN
- Liang; Le - Taoyuan Hsien CN
- Liang; Le - Beijing CN
Patent Activity
| Patent | Date |
|---|---|
| Manufacturing method of power module Grant 11,435,797 - Hong , et al. September 6, 2 | 2022-09-06 |
| Communication Devices And Methods Based On Markov-chain Monte-carlo (mcmc) Sampling App 20220209891 - Krishnamurthy; Sundar ; et al. | 2022-06-30 |
| Power supply module and manufacture method for same Grant 11,316,438 - Ji , et al. April 26, 2 | 2022-04-26 |
| Power supply module and manufacture method for same Grant 11,063,525 - Ji , et al. July 13, 2 | 2021-07-13 |
| Manufacturing Method Of Power Module App 20210200285 - Hong; Shouyu ; et al. | 2021-07-01 |
| Power module and manufacturing method thereof Grant 11,036,269 - Hong , et al. June 15, 2 | 2021-06-15 |
| Probabilistic Sampling Acceleration And Corner Feature Extraction For Vehicle Systems App 20210174122 - Campos Macias; Leobardo ; et al. | 2021-06-10 |
| Power integrated module Grant 11,024,588 - Zeng , et al. June 1, 2 | 2021-06-01 |
| Alternatingly-switched parallel circuit, integrated power module and integrated power package Grant 10,985,645 - Cai , et al. April 20, 2 | 2021-04-20 |
| Power Chip App 20210072807 - LIANG; Le ; et al. | 2021-03-11 |
| Power Chip And Bridge Circuit App 20210013793 - XIN; Xiaoni ; et al. | 2021-01-14 |
| Antenna Controller For Antenna With Linearized Power Amplifiers App 20200403649 - ALEXANDERSON; Mats ; et al. | 2020-12-24 |
| Power chip Grant 10,871,811 - Chen , et al. December 22, 2 | 2020-12-22 |
| Power chip and bridge circuit Grant 10,826,483 - Chen , et al. November 3, 2 | 2020-11-03 |
| Power Integrated Module App 20200303326 - ZENG; Jianhong ; et al. | 2020-09-24 |
| Power Module And Manufacturing Method Thereof App 20200260586 - A1 | 2020-08-13 |
| Power Supply Module And Manufacture Method For Same App 20200220474 - JI; Pengkai ; et al. | 2020-07-09 |
| Power Supply Module And Manufacture Method For Same App 20200220473 - JI; Pengkai ; et al. | 2020-07-09 |
| Alternatingly-switched Parallel Circuit, Integrated Power Module And Integrated Power Package App 20200195123 - CAI; Chaofeng ; et al. | 2020-06-18 |
| Power integrated module Grant 10,629,550 - Zeng , et al. | 2020-04-21 |
| Alternatingly-switched parallel circuit, integrated power module and integrated power package Grant 10,620,654 - Cai , et al. | 2020-04-14 |
| Method For Manufacturing A Stack Structure App 20190261531 - LIANG; Le ; et al. | 2019-08-22 |
| Stack structure and the manufacturing method of the same Grant 10,342,153 - Liang , et al. | 2019-07-02 |
| Power modules and pin thereof Grant 10,340,617 - Liang , et al. | 2019-07-02 |
| Alternatingly-switched Parallel Circuit, Integrated Power Module And Integrated Power Package App 20190146541 - CAI; Chaofeng ; et al. | 2019-05-16 |
| Power Module And Manufacturing Method Thereof App 20190138069 - Hong; Shouyu ; et al. | 2019-05-09 |
| Power Chip App 20190086975 - CHEN; Yan ; et al. | 2019-03-21 |
| Stacked package module having an exposed heat sink surface from the packaging Grant 10,204,882 - Liang , et al. Feb | 2019-02-12 |
| Interleaved parallel circuit, integrated power module and integrated power chip Grant 10,198,020 - Cai , et al. Fe | 2019-02-05 |
| Power chip Grant 10,126,795 - Chen , et al. November 13, 2 | 2018-11-13 |
| Power module package Grant 10,096,562 - Liang , et al. October 9, 2 | 2018-10-09 |
| Package Module, Stack Structure Of Package Module, And Fabricating Methods Thereof App 20180082980 - LIANG; Le ; et al. | 2018-03-22 |
| Power Chip App 20180059749 - CHEN; Yan ; et al. | 2018-03-01 |
| Power Chip And Bridge Circuit App 20180062638 - CHEN; Yan ; et al. | 2018-03-01 |
| Interleaved Parallel Circuit, Integrated Power Module And Integrated Power Chip App 20180059705 - CAI; Chaofeng ; et al. | 2018-03-01 |
| Package module of power conversion circuit and manufacturing method thereof Grant 9,892,998 - Lu , et al. February 13, 2 | 2018-02-13 |
| Package module having exposed heat sink Grant 9,875,991 - Liang , et al. January 23, 2 | 2018-01-23 |
| Molding type power module Grant 9,748,205 - Lu , et al. August 29, 2 | 2017-08-29 |
| Power Integrated Module App 20170133332 - ZENG; Jianhong ; et al. | 2017-05-11 |
| Stack Structure And The Manufacturing Method Of The Same App 20170112001 - LIANG; Le ; et al. | 2017-04-20 |
| Power Module Package App 20170025379 - LIANG; Le ; et al. | 2017-01-26 |
| Molding Type Power Module App 20160381785 - LU; Kai ; et al. | 2016-12-29 |
| Power Modules And Pin Thereof App 20160366780 - Liang; Le ; et al. | 2016-12-15 |
| Package Module, Stack Structure Of Package Module, And Fabricating Methods Thereof App 20160358837 - LIANG; Le ; et al. | 2016-12-08 |
| Method and apparatus for interference control Grant 9,479,312 - Li , et al. October 25, 2 | 2016-10-25 |
| Package Module Of Power Conversion Circuit And Manufacturing Method Thereof App 20160254217 - LU; Kai ; et al. | 2016-09-01 |
| Method And Apparatus For Interference Control App 20150110020 - Li; Chaofeng ; et al. | 2015-04-23 |
uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.
While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.
All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.
| 