loadpatents
Patent applications and USPTO patent grants for LIANG; KAI-CHIH.The latest application filed is for "semiconductor device manufacturing system and method for manufacturing semiconductor device".
Patent | Date |
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Semiconductor Device Manufacturing System And Method For Manufacturing Semiconductor Device App 20220165592 - LIANG; KAI-CHIH ;   et al. | 2022-05-26 |
MEMS devices and methods of forming same Grant 11,180,365 - Liang , et al. November 23, 2 | 2021-11-23 |
Cmos Compatible Biofet App 20200150080 - KALNITSKY; Alexander ;   et al. | 2020-05-14 |
MEMS Devices and Methods of Forming Same App 20200062588 - Liang; Kai-Chih ;   et al. | 2020-02-27 |
CMOS compatible BioFET Grant 10,520,467 - Kalnitsky , et al. Dec | 2019-12-31 |
MEMS devices and methods of forming same Grant 10,457,550 - Liang , et al. Oc | 2019-10-29 |
MEMS Devices and Methods of Forming Same App 20190047851 - Liang; Kai-Chih ;   et al. | 2019-02-14 |
MEMS devices and methods of forming same Grant 10,099,919 - Liang , et al. October 16, 2 | 2018-10-16 |
Cmos Compatible Biofet App 20180195998 - Kalnitsky; Alexander ;   et al. | 2018-07-12 |
CMOS compatible BioFET Grant 9,910,009 - Kalnitsky , et al. March 6, 2 | 2018-03-06 |
CMOS Compatible BioFET App 20170322177 - Kalnitsky; Alexander ;   et al. | 2017-11-09 |
CMOS compatible BioFET Grant 9,791,406 - Kalnitsky , et al. October 17, 2 | 2017-10-17 |
Dual layer microelectromechanical systems device and method of manufacturing same Grant 9,617,147 - Chu , et al. April 11, 2 | 2017-04-11 |
Mems Devices And Methods Of Forming Same App 20170066647 - Liang; Kai-Chih ;   et al. | 2017-03-09 |
Cmos Compatible Biofet App 20170023521 - KALNITSKY; Alexander ;   et al. | 2017-01-26 |
MEMS devices and methods of forming same Grant 9,499,396 - Liang , et al. November 22, 2 | 2016-11-22 |
CMOS compatible BioFET Grant 9,459,234 - Kalnitsky , et al. October 4, 2 | 2016-10-04 |
VHF etch barrier for semiconductor integrated microsystem Grant 9,449,867 - Wu , et al. September 20, 2 | 2016-09-20 |
MEMS devices, packaged MEMS devices, and methods of manufacture thereof Grant 9,359,194 - Liang , et al. June 7, 2 | 2016-06-07 |
CMOS-MEMS integrated flow for making a pressure sensitive transducer Grant 9,254,997 - Cheng , et al. February 9, 2 | 2016-02-09 |
Vhf Etch Barrier For Semiconductor Integrated Microsystem App 20150364363 - Wu; Tzu-Heng ;   et al. | 2015-12-17 |
MEMS structure with adaptable inter-substrate bond Grant 9,133,017 - Liang , et al. September 15, 2 | 2015-09-15 |
Dual Layer Microelectromechanical Systems Device and Method of Manufacturing Same App 20150217996 - Chu; Chia-Hua ;   et al. | 2015-08-06 |
MEMS Devices and Methods of Forming Same App 20150158723 - Liang; Kai-Chih ;   et al. | 2015-06-11 |
MEMS Devices, Packaged MEMS Devices, and Methods of Manufacture Thereof App 20150137283 - Liang; Kai-Chih ;   et al. | 2015-05-21 |
Dual layer microelectromechanical systems device and method of manufacturing same Grant 9,006,015 - Chu , et al. April 14, 2 | 2015-04-14 |
MEMS devices and methods of forming same Grant 8,987,059 - Liang , et al. March 24, 2 | 2015-03-24 |
CMOS-MEMS Integrated Flow for Making a Pressure Sensitive Transducer App 20150060954 - Cheng; Chun-Wen ;   et al. | 2015-03-05 |
MEMS devices, packaged MEMS devices, and methods of manufacture thereof Grant 8,952,465 - Liang , et al. February 10, 2 | 2015-02-10 |
MEMS Structure with Adaptable Inter-Substrate Bond App 20140353776 - Liang; Kai-Chih ;   et al. | 2014-12-04 |
Dual Layer Microelectromechanical Systems Device and Method of Manufacturing Same App 20140206123 - Chu; Chia-Hua ;   et al. | 2014-07-24 |
MEMS structure with adaptable inter-substrate bond Grant 8,748,205 - Liang , et al. June 10, 2 | 2014-06-10 |
Mems Structure With Adaptable Inter-substrate Bond App 20140151821 - Liang; Kai-Chih ;   et al. | 2014-06-05 |
Inline process control structures Grant 8,647,892 - Liang , et al. February 11, 2 | 2014-02-11 |
MEMS device etch stop Grant 8,633,554 - Chu , et al. January 21, 2 | 2014-01-21 |
MEMS Devices, Packaged MEMS Devices, and Methods of Manufacture Thereof App 20140015069 - Liang; Kai-Chih ;   et al. | 2014-01-16 |
MEMS Devices and Methods of Forming Same App 20130168852 - Liang; Kai-Chih ;   et al. | 2013-07-04 |
Mems Device Etch Stop App 20130140653 - Chu; Chia-Hua ;   et al. | 2013-06-06 |
Cmos Compatible Biofet App 20130105868 - Kalnitsky; Alexander ;   et al. | 2013-05-02 |
MEMS device etch stop Grant 8,368,152 - Chu , et al. February 5, 2 | 2013-02-05 |
Mems Device Etch Stop App 20120261830 - Chu; Chia-Hua ;   et al. | 2012-10-18 |
Inline Process Control Structures App 20120091454 - Liang; Kai-Chih ;   et al. | 2012-04-19 |
Method of fabricating an integrated CMOS-MEMS device Grant 8,012,785 - Liang , et al. September 6, 2 | 2011-09-06 |
Method Of Fabricating An Integrated CMOS-MEMS Device App 20100273286 - Liang; Kai-Chih ;   et al. | 2010-10-28 |
Process for wafer bonding Grant 7,732,299 - Chang , et al. June 8, 2 | 2010-06-08 |
Process For Wafer Bonding App 20080194076 - Chang; Fa-Yuan ;   et al. | 2008-08-14 |
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