Liang; Jimmy
Patent Applications and Registrations
Patent applications and USPTO patent grants for Liang; Jimmy.The latest application filed is for "package structures and methods for forming the same".
- Liang; Jimmy - Zhongli City TW
- Liang; Jimmy - Zhongli TW
- Liang; Jimmy - Taoyuan County N/A TW
- Liang; Jimmy - Chung-Li TW
- Liang; Jimmy - Chung-Li City TW
- Liang; Jimmy - Taipei TW
- Liang, Jimmy - Taipei City TW
Trademarks
| Patent | Date |
|---|---|
| Package Structures and Methods for Forming the Same App 20160268145 - Meng; Hsien-Liang ; et al. | 2016-09-15 |
| Package structures and methods for forming the same Grant 9,362,236 - Meng , et al. June 7, 2 | 2016-06-07 |
| Package Structures and Methods for Forming the Same App 20140252594 - Meng; Hsien-Liang ; et al. | 2014-09-11 |
| Easily stackable dies Grant 8,424,357 - Lu , et al. April 23, 2 | 2013-04-23 |
| Integrated circuit card Grant 8,416,576 - Chu , et al. April 9, 2 | 2013-04-09 |
| Flash memory Grant 8,184,464 - Chu , et al. May 22, 2 | 2012-05-22 |
| Layered Integrated Circuit Apparatus App 20120091595 - MA; Sung Chuan ; et al. | 2012-04-19 |
| Chip holder with wafer level redistribution layer Grant 8,049,323 - Chen , et al. November 1, 2 | 2011-11-01 |
| Integrated Circuit Card App 20110228487 - Chu; Tse Min ; et al. | 2011-09-22 |
| Integrated Circuit App 20110108983 - Lu; Leo ; et al. | 2011-05-12 |
| Chip Stacking Device Having Re-Distribution Layer App 20110062590 - Lu; Leo ; et al. | 2011-03-17 |
| Chip for Reliable Stacking on another Chip App 20110062586 - Lu; Leo ; et al. | 2011-03-17 |
| Easily Stackable Dies App 20110023574 - Lu; Leo ; et al. | 2011-02-03 |
| Flash memory App 20110019457 - Chu; Kuei-Wu ; et al. | 2011-01-27 |
| Enhanced reliability of wafer-level chip-scale packaging (WLCSP) die separation using dry etching Grant 7,838,424 - Karta , et al. November 23, 2 | 2010-11-23 |
| Ball-mounting method for coplanarity improvement in large package Grant 7,642,129 - Liang , et al. January 5, 2 | 2010-01-05 |
| Enhanced Reliability of Wafer-Level Chip-Scale Packaging (WLCSP) Die Separation Using Dry Etching App 20090011543 - Karta; Tjandra Winata ; et al. | 2009-01-08 |
| Chip Holder With Wafer Level Redistribution Layer App 20080197473 - Chen; Chen-Shien ; et al. | 2008-08-21 |
| Ball-mounting method for coplanarity improvement in large package App 20080160671 - Liang; Jimmy ; et al. | 2008-07-03 |
| Method and apparatus for flip chip device assembly by radiant heating Grant 7,056,767 - Liang , et al. June 6, 2 | 2006-06-06 |
| Method and apparatus for flip chip device assembly by radiant heating App 20040108600 - Liang, Jimmy ; et al. | 2004-06-10 |
| Method and apparatus for flip chip device assembly by radiant heating App 20030132528 - Liang, Jimmy ; et al. | 2003-07-17 |
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