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name:-0.0058591365814209
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Liang; Jarrett Jun Patent Filings

Liang; Jarrett Jun

Patent Applications and Registrations

Patent applications and USPTO patent grants for Liang; Jarrett Jun.The latest application filed is for "copper interconnects separated by air gaps and method of making thereof".

Company Profile
0.6.5
  • Liang; Jarrett Jun - San Francisco CA
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Semiconductor device with copper interconnects separated by air gaps
Grant 9,030,016 - Purayath , et al. May 12, 2
2015-05-12
Copper Interconnects Separated By Air Gaps And Method Of Making Thereof
App 20140008804 - Purayath; Vinod R. ;   et al.
2014-01-09
Copper interconnects separated by air gaps and method of making thereof
Grant 8,575,000 - Purayath , et al. November 5, 2
2013-11-05
Metal control gate formation in non-volatile storage
Grant 8,409,951 - Liang , et al. April 2, 2
2013-04-02
Copper Interconnects Separated by Air Gaps and Method of Making Thereof
App 20130020708 - Purayath; Vinod R. ;   et al.
2013-01-24
Metal control gate formation in non-volatile storage
Grant 8,278,203 - Liang , et al. October 2, 2
2012-10-02
Metal Control Gate Formation In Non-volatile Storage
App 20120187468 - Liang; Jarrett Jun ;   et al.
2012-07-26
Metal Control Gate Formation In Non-volatile Storage
App 20120025289 - Liang; Jarrett Jun ;   et al.
2012-02-02

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