LIANG; Dexin

Patent Applications and Registrations

Patent applications and USPTO patent grants for LIANG; Dexin.The latest application filed is for "rotary coupling structure, power supply device and sofa".

Company Profile

4.15.5

LIANG; Dexin - Huizhou CN
Liang; Dexin - Guangdong CN
Liang; Dexin - Freemont CA
Liang; Dexin - Fremont CA
Liang; Dexin - Modesto CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Rotary Coupling Structure, Power Supply Device And Sofa App 20210098935 - LIANG; Dexin ; et al.	2021-04-01
Power adapter Grant D904,300 - Liang , et al. December 8, 2	2020-12-08
Power adapter Grant D895,548 - Liang , et al. Sep	2020-09-08
Detachable Combined Lithium Battery Power Supply App 20200106064 - LIANG; Dexin ; et al.	2020-04-02
Switch power circuit with backup battery for power supply Grant 10,236,715 - Liang	2019-03-19
Switch Power Circuit With Backup Battery For Power Supply App 20170085123 - Liang; Dexin	2017-03-23
Methods of packaging an integrated circuit and methods of forming an integrated circuit package Grant RE42,457 - Zhao , et al. June 14, 2	2011-06-14
Integrated circuit package, ball-grid array integrated circuit package Grant RE42,332 - Zhao , et al. May 10, 2	2011-05-10
Integrated circuit package, ball-grid array integrated circuit package Grant 6,630,737 - Zhao , et al. October 7, 2	2003-10-07
Integrated Circuit Package, Ball-grid Array Integrated Circuit Package And Methods Of Packaging An Integrated Circuit App 20010015497 - ZHAO, LILY ; et al.	2001-08-23
Integrated circuit device with integral decoupling capacitor Grant 6,222,260 - Liang , et al. April 24, 2	2001-04-24
Methods of packaging an integrated circuit and methods of forming an integrated circuit package Grant 6,207,476 - Zhao , et al. March 27, 2	2001-03-27
Interposer for ball grid array (BGA) package Grant 5,972,734 - Carichner , et al. October 26, 1	1999-10-26
Anodized aluminum substrate having increased breakdown voltage Grant 5,688,606 - Mahulikar , et al. November 18, 1	1997-11-18
Microelectronic integrated circuit mounted on circuit board with solder column grid array interconnection, and method of fabricating the solder column grid array Grant 5,639,696 - Liang , et al. June 17, 1	1997-06-17
Anodized aluminum substrate having increased breakdown voltage Grant 5,534,356 - Mahulikar , et al. July 9, 1	1996-07-09
Chamfered electronic package component Grant 5,455,386 - Brathwaite , et al. October 3, 1	1995-10-03
Multi-chip electronic package module utilizing an adhesive sheet Grant 5,360,942 - Hoffman , et al. November 1, 1	1994-11-01

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