Lian; Sean

Patent Applications and Registrations

Patent applications and USPTO patent grants for Lian; Sean.The latest application filed is for "forming self-aligned contact with spacer first".

Company Profile

2.10.11

Lian; Sean - Slingerlands NY
Lian; Sean - Cohoes NY
Lian; Sean - Berne NY
Lian; Sean - Singapore SG
Lian; Sean - Allentown PA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Forming Self-Aligned Contact with Spacer First App 20190027580 - Fan; Su Chen ; et al.	2019-01-24
Forming self-aligned contact with spacer first Grant 10,186,599 - Fan , et al. Ja	2019-01-22
Freestanding spacer having sub-lithographic lateral dimension and method of forming same Grant 9,653,571 - Chen , et al. May 16, 2	2017-05-16
Freestanding Spacer Having Sub-lithographic Lateral Dimension And Method Of Forming Same App 20160365425 - Chen; Hsueh-Chung ; et al.	2016-12-15
Integrated circuit structure with electrical strap and its method of forming Grant 8,188,550 - Yang , et al. May 29, 2	2012-05-29
Semiconductor structure formed using a sacrificial structure Grant 7,741,702 - Jones , et al. June 22, 2	2010-06-22
Methods and apparatus for determining pad height for a wire-bonding operation in an integrated circuit Grant 7,705,473 - Lian , et al. April 27, 2	2010-04-27
Integrated Circuit Structure With Electrical Strap App 20090166758 - YANG; Lieyong ; et al.	2009-07-02
Integrated Manufacturing System With Transistor Drive Current Control App 20090081814 - Lei; Ming ; et al.	2009-03-26
Semiconductor Structure Formed Using a Sacrificial Structure App 20080054481 - Jones; Bailey R. ; et al.	2008-03-06
Metallization performance in electronic devices Grant 7,339,274 - Desko, Jr. , et al. March 4, 2	2008-03-04
Semiconductor structure formed using a sacrificial structure Grant 7,329,605 - Jones , et al. February 12, 2	2008-02-12
Semiconductor structure formed using a sacrificial structure App 20060226552 - Jones; Bailey R. ; et al.	2006-10-12
Methods and apparatus for determining pad height for a wire-bonding operation in an integrated circuit App 20060157871 - Lian; Sean ; et al.	2006-07-20
Methods and apparatus for determining pad height for a wire-bonding operation in an integrated circuit Grant 7,056,819 - Lian , et al. June 6, 2	2006-06-06
Metallization performance in electronic devices App 20060038294 - Desko; John C. JR. ; et al.	2006-02-23
Method for making enhanced substrate contact for a semiconductor device Grant 6,987,052 - Baiocchi , et al. January 17, 2	2006-01-17
Methods and apparatus for the detection of damaged regions on dielectric film or other portions of a die Grant 6,919,228 - Lian , et al. July 19, 2	2005-07-19
Enhanced substrate contact for a semiconductor device App 20050093097 - Baiocchi, Frank A. ; et al.	2005-05-05
Methods And Apparatus For The Detection Of Damaged Regions On Dielectric Film Or Other Portions Of A Die App 20050092987 - Lian, Sean ; et al.	2005-05-05
Methods and apparatus for determining pad height for a wire-bonding operation in an integrated circuit App 20050067678 - Lian, Sean ; et al.	2005-03-31

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