LIAN; Bin
Patent Applications and Registrations
Patent applications and USPTO patent grants for LIAN; Bin.The latest application filed is for "camera and surveillance system for video surveillance".
- LIAN; Bin - Zhejiang CN
- Lian; Bin - Portland OR
- Lian; Bin - Hillsboro OR
Trademarks
| Patent | Date |
|---|---|
| Camera And Surveillance System For Video Surveillance App 20180220103 - WANG; Yanxia ; et al. | 2018-08-02 |
| Microplates, reaction modules and detection systems Grant 8,968,684 - Lian March 3, 2 | 2015-03-03 |
| Microplates, Reaction Modules and Detection Systems App 20120276541 - Lian; Bin | 2012-11-01 |
| Circuit board with added impedance Grant 7,057,114 - Dishongh , et al. June 6, 2 | 2006-06-06 |
| Semiconductor device with components embedded in backside diamond layer Grant 6,913,999 - Searls , et al. July 5, 2 | 2005-07-05 |
| Metallurgically enhanced heat sink Grant 6,797,085 - Dishongh , et al. September 28, 2 | 2004-09-28 |
| Circuit board with added impedance Grant 6,775,122 - Dishongh , et al. August 10, 2 | 2004-08-10 |
| Surface mount connector lead Grant 6,774,310 - Dishongh , et al. August 10, 2 | 2004-08-10 |
| Iodine-containing thermal interface material Grant 6,752,204 - Dishongh , et al. June 22, 2 | 2004-06-22 |
| Electrically modifiable product labeling Grant 6,731,221 - Dioshongh , et al. May 4, 2 | 2004-05-04 |
| Circuit board with added impedance App 20040057184 - Dishongh, Terry ; et al. | 2004-03-25 |
| Semiconductor device with components embedded in backside diamond layer App 20040056272 - Searls, Damion T. ; et al. | 2004-03-25 |
| Electrically modifiable product labeling App 20040017295 - Dishongh, Terrance J. ; et al. | 2004-01-29 |
| Semiconductor device with components embedded in backside diamond layer Grant 6,649,937 - Searls , et al. November 18, 2 | 2003-11-18 |
| Fluorescence emission ratio imaging thermography for use in heat transfer analysis Grant 6,648,506 - McGrath , et al. November 18, 2 | 2003-11-18 |
| Semiconductor Device With Components Embedded In Backside Diamond Layer App 20030183823 - Searls, Damion T. ; et al. | 2003-10-02 |
| Fluorescence emission ratio imaging thermography for use in heat transfer analysis App 20030128737 - McGrath, John J. ; et al. | 2003-07-10 |
| Self-powered wireless device App 20030080938 - Lian, Bin ; et al. | 2003-05-01 |
| Vapor chamber active heat sink Grant 6,550,531 - Searls , et al. April 22, 2 | 2003-04-22 |
| Iodine-containing thermal interface material App 20030051868 - Dishongh, Terrance J. ; et al. | 2003-03-20 |
| Process for local on-chip cooling of semiconductor devices using buried microchannels Grant 6,521,516 - Monzon , et al. February 18, 2 | 2003-02-18 |
| Ergonomic auxiliary screen and display subsystem for portable handheld devices App 20030006942 - Searls, Damion ; et al. | 2003-01-09 |
| Process For Local On-chip Cooling Of Semiconductor Devices Using Buried Microchannels App 20030003698 - Monzon, Franklin G. ; et al. | 2003-01-02 |
| Circuit card assembly having controlled vibrational properties Grant 6,486,589 - Dujari , et al. November 26, 2 | 2002-11-26 |
| Heat dissipation device App 20020118511 - Dujari, Prateek J. ; et al. | 2002-08-29 |
| Conduited heat dissipation device App 20020067596 - Searls, Damion T. ; et al. | 2002-06-06 |
| Heat sink with integrated fluid circulation pump Grant 6,327,145 - Lian , et al. December 4, 2 | 2001-12-04 |
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