Li; Zong-Hua
Patent Applications and Registrations
Patent applications and USPTO patent grants for Li; Zong-Hua.The latest application filed is for "circuit board and method for manufacturing the same".
- Li; Zong-Hua - Taoyuan TW
- LI; Zong-Hua - Taoyuan City TW
| Patent | Date |
|---|---|
| Multilayer circuit board structure and manufacturing method thereof Grant 10,736,215 - Lee , et al. | 2020-08-04 |
| Structure and manufacturing method of heat dissipation substrate and package structure and method thereof Grant 10,497,847 - Liu , et al. De | 2019-12-03 |
| Circuit board and method for manufacturing the same Grant 10,468,570 - Liao , et al. No | 2019-11-05 |
| Circuit Board And Method For Manufacturing The Same App 20190181315 - LIAO; Po-Hsuan ; et al. | 2019-06-13 |
| Structure And Manufacturing Method Of Heat Dissipation Substrate And Package Structure And Method Thereof App 20190067543 - Liu; Wen-Fang ; et al. | 2019-02-28 |
| Chip Package Circuit Board Module App 20180368263 - Liu; Wen-Fang ; et al. | 2018-12-20 |
| Chip package circuit board module Grant 10,159,151 - Liu , et al. Dec | 2018-12-18 |
| Chip package circuit board module Grant 10,056,356 - Liu , et al. August 21, 2 | 2018-08-21 |
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