Patent applications and USPTO patent grants for Li; Zhi-Yong.The latest application filed is for "method for manufacturing printed circuit board".
Patent | Date |
---|---|
Method for manufacturing printed circuit board Grant 8,978,244 - Cai , et al. March 17, 2 | 2015-03-17 |
Method for manufacturing printed circuit board with cavity Grant 8,516,694 - Cai , et al. August 27, 2 | 2013-08-27 |
Method For Manufacturing Printed Circuit Board App 20110302775 - CAI; XUE-JUN ;   et al. | 2011-12-15 |
Method For Manufacturing Printed Circuit Board With Cavity App 20110297644 - CAI; XUE-JUN ;   et al. | 2011-12-08 |
Cable assembly with wire management board and method of manufacturing the same Grant 7,510,425 - Kuo , et al. March 31, 2 | 2009-03-31 |
Cable connector assembly with simplified grounding path Grant 7,470,150 - Kuo , et al. December 30, 2 | 2008-12-30 |
Cable assembly with wire management board and method of manufacturing the same App 20080064254 - Kuo; Peter ;   et al. | 2008-03-13 |
Cable connector assembly with simplified grounding path App 20070141907 - Kuo; Peter ;   et al. | 2007-06-21 |
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