Li; Zhaozhi
Patent Applications and Registrations
Patent applications and USPTO patent grants for Li; Zhaozhi.The latest application filed is for "electronic package with stud bump electrical connections".
- Li; Zhaozhi - Chandler AZ
| Patent | Date |
|---|---|
| Electronic Package With Stud Bump Electrical Connections App 20210366862 - Li; Zhaozhi ; et al. | 2021-11-25 |
| Electronic package with stud bump electrical connections Grant 11,127,706 - Li , et al. September 21, 2 | 2021-09-21 |
| Electronic Package With Stud Bump Electrical Connections App 20200105701 - Li; Zhaozhi ; et al. | 2020-04-02 |
| Micro-trenching Mold Interface In A Pop Package App 20200035658 - SINGH; Kumar Abhishek ; et al. | 2020-01-30 |
| Architecture material and process to improve thermal performance of the embedded die package Grant 10,121,722 - Jha , et al. November 6, 2 | 2018-11-06 |
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