| Patent | Date |
|---|
Woody Rootstock For Efficient Grafting Of Solanaceous Vegetables And Efficient Grafting And Seedling Culture Method Thereof
App 20220022378 - CHEN; Liping ; et al. | 2022-01-27 |
Chemical-mechanical polishing composition comprising benzotriazole derivatives as corrosion inhibitors
Grant 11,168,239 - Reichardt , et al. November 9, 2 | 2021-11-09 |
Chemical-mechanical Polishing Composition Comprising Benzotriazole Derivatives As Corrosion Inhibitors
App 20200255713 - Kind Code | 2020-08-13 |
Chemical-mechanical polishing composition comprising benzotriazole derivatives as corrosion inhibitors
Grant 10,647,900 - Reichardt , et al. | 2020-05-12 |
Chemical mechanical polishing (CMP) composition comprising a polymeric polyamine
Grant 10,407,594 - Noller , et al. Sept | 2019-09-10 |
Process for removing a bulk material layer from a substrate and a chemical mechanical polishing agent suitable for this process
Grant 10,392,531 - Raman , et al. A | 2019-08-27 |
Chemical-mechanical polishing composition comprising organic/inorganic composite particles
Grant 10,214,663 - Lan , et al. Feb | 2019-02-26 |
Chemical mechanical polishing (CMP) composition comprising a protein
Grant 9,777,192 - Li , et al. October 3, 2 | 2017-10-03 |
Automated And Assisted Generation Of Surveys
App 20170161759 - Li; Yang ; et al. | 2017-06-08 |
Method for forming through-base wafer vias
Grant 9,496,146 - Li , et al. November 15, 2 | 2016-11-15 |
Chemical mechanical polishing (CMP) composition comprising a glycoside
Grant 9,487,674 - Li , et al. November 8, 2 | 2016-11-08 |
Chemical mechanical polishing composition comprising polyvinyl phosphonic acid and its derivatives
Grant 9,487,675 - Raman , et al. November 8, 2 | 2016-11-08 |
Post chemical-mechanical-polishing (post-CMP) cleaning composition comprising a specific sulfur-containing compound and a sugar alcohol or a polycarboxylic acid
Grant 9,458,415 - Li , et al. October 4, 2 | 2016-10-04 |
Raspberry-type Metal Oxide Nanostructures Coated With Ceo2 Nanoparticles For Chemical Mechanical Planarization (cmp)
App 20160280963 - ZHANG; Zhihua ; et al. | 2016-09-29 |
Process for the manufacture of semiconductor devices comprising the chemical mechanical polishing of elemental germanium and/or Si.sub.1-xGe.sub.x material in the presence of a CMP composition comprising a specific organic compound
Grant 9,443,739 - Noller , et al. September 13, 2 | 2016-09-13 |
Process for the manufacture of semiconductor devices comprising the chemical mechanical polishing (CMP) of III-V material in the presence of a CMP composition comprising a specific non-ionic surfactant
Grant 9,416,298 - Li , et al. August 16, 2 | 2016-08-16 |
Chemical-mechanical Polishing Composition Comprising Benzotriazole Derivatives As Corrosion Inhibitors
App 20160200943 - REICHARDT; Robert ; et al. | 2016-07-14 |
Cmp Composition Comprising Abrasive Particles Containing Ceria
App 20160160083 - LAUTER; Michael ; et al. | 2016-06-09 |
Abrasive articles, method for their preparation and method of their use
Grant 9,309,448 - Kujat , et al. April 12, 2 | 2016-04-12 |
Chemical mechanical polishing (CMP) composition comprising two types of corrosion inhibitors
Grant 9,263,296 - Noller , et al. February 16, 2 | 2016-02-16 |
Chemical mechanical polishing (CMP) composition comprising inorganic particles and polymer particles
Grant 9,255,214 - Lauter , et al. February 9, 2 | 2016-02-09 |
Chemical-mechanical Planarization Of Substrates Containing Copper, Ruthenium, And Tantalum Layers
App 20160035582 - LI; Yuzhuo ; et al. | 2016-02-04 |
Aqueous polishing composition and process for chemically mechanically polishing substrates having patterned or unpatterned low-k dielectric layers
Grant 9,070,632 - Raman , et al. June 30, 2 | 2015-06-30 |
Process For The Manufacture Of Semiconductor Devices Comprising The Chemical Mechanical Polishing (cmp) Of Iii-v Material In The Presence Of A Cmp Composition Comprising A Specific Non-ionic Surfactant
App 20150175845 - Li; Yuzhuo ; et al. | 2015-06-25 |
Chemical Mechanical Polishing Composition Comprising Polyvinyl Phosphonic Acid And Its Derivatives
App 20150159050 - Raman; Vijay Immanuel ; et al. | 2015-06-11 |
Process for removing a bulk material layer from a substrate and a chemical mechanical polishing agent suitable for this process
Grant 9,028,708 - Raman , et al. May 12, 2 | 2015-05-12 |
Chemical Mechanical Polishing (cmp) Composition Comprising Two Types Of Corrosion Inhibitors
App 20150118845 - Noller; Bastian ; et al. | 2015-04-30 |
Aqueous polishing agent and graft copolymers and their use in a process for polishing patterned and unstructured metal surfaces
Grant 9,005,472 - Raman , et al. April 14, 2 | 2015-04-14 |
Chemical mechanical polishing (CMP) composition comprising a non-ionic surfactant and a carbonate salt
Grant 8,980,750 - Reichardt , et al. March 17, 2 | 2015-03-17 |
Chemical Mechanical Polishing (cmp) Composition Comprising A Protein
App 20150017454 - Li; Yuzhuo ; et al. | 2015-01-15 |
Post Chemical-mechanical-polishing (post-cmp) Cleaning Composition Comprising A Specific Sulfur-containing Compound And A Sugar Alcohol Or A Polycarboxylic Acid
App 20150018261 - Li; Yuzhuo ; et al. | 2015-01-15 |
Chemical mechanical polishing (CMP) composition comprising a specific heteropolyacid
Grant 8,927,429 - Schmitt , et al. January 6, 2 | 2015-01-06 |
Chemical Mechanical Polishing (cmp) Composition Comprising A Glycoside
App 20140213057 - Li; Yuzhuo ; et al. | 2014-07-31 |
Process For The Manufacture Of Semiconductor Devices Comprising The Chemical Mechanical Polishing Of Elemental Germanium And/or Si1-xgex Material In The Presence Of A Cmp Composition Having A Ph Value Of 3.0 To 5.5
App 20140199841 - Noller; Bastian Marten ; et al. | 2014-07-17 |
Process For The Manufacture Of Semiconductor Devices Comprising The Chemical Mechanical Polishing Of Elemental Germanium And/or Si1-xgex Material In The Presence Of A Cmp Composition Comprising A Specific Organic Compound
App 20140170852 - Noller; Bastian Marten ; et al. | 2014-06-19 |
Aqueous polishing agent comprising solid polymer particles and two complexing agents and its use in a process for polishing patterned and unstructured metal surfaces
Grant 8,747,687 - Raman , et al. June 10, 2 | 2014-06-10 |
Oxidizing particles based slurry for nobel metal including ruthenium chemical mechanical planarization
Grant 8,684,793 - Li , et al. April 1, 2 | 2014-04-01 |
Aqueous metal polishing agent comprising a polymeric abrasiv containing pendant functional groups and its use in a CMP process
Grant 8,679,980 - Raman , et al. March 25, 2 | 2014-03-25 |
Chemical Mechanical Polishing (cmp) Composition Comprising A Non-ionic Surfactant And An Aromatic Compound Comprising At Least One Acid Group
App 20140011362 - REICHARDT; Robert ; et al. | 2014-01-09 |
Chemical Mechanical Polishing (cmp) Composition Comprising A Polymeric Polyamine
App 20140004703 - Noller; Bastian Marten ; et al. | 2014-01-02 |
Method For Forming Through-base Wafer Vias
App 20130344696 - Li; Yuzhuo ; et al. | 2013-12-26 |
Chemical mechanical polishing (CMP) polishing solution with enhanced performance
Grant 8,597,539 - Li , et al. December 3, 2 | 2013-12-03 |
Aqueous Polishing Composition And Process For Chemically Mechanically Polishing Substrates Having Patterned Or Unpatterned Low-k Dielectric Layers
App 20130273739 - Raman; Vijay Immanuel ; et al. | 2013-10-17 |
Chemical Mechanical Polishing (cmp) Composition
App 20130217231 - Drescher; Bettina ; et al. | 2013-08-22 |
Aqueous Polishing Composition And Process For Chemically Mechanically Polishing Substrates For Electrical, Mechanical And Optical Devices
App 20130200038 - Li; Yuzhuo ; et al. | 2013-08-08 |
Aqueous Polishing Compositions Containing N-substituted Diazenium Dioxides And/or N'-hydroxy-diazenium Oxide Salts
App 20130200039 - Noller; Bastian ; et al. | 2013-08-08 |
Chemical Mechanical Polishing (cmp) Composition Comprising A Specific Heteropolyacid
App 20130189842 - Schmitt; Christine ; et al. | 2013-07-25 |
Aqueous Polishing Composition And Process For Chemically Mechanically Polishing Substrates Containing Silicon Oxide Dielectric And Polysilicon Films
App 20130168348 - Li; Yuzhuo ; et al. | 2013-07-04 |
Process For Chemically Mechanically Polishing Substrates Containing Silicon Oxide Dielectric Films And Polysilicon And/or Silicon Nitride Films
App 20130171824 - Li; Yuzhuo ; et al. | 2013-07-04 |
Aqueous Polishing Composition And Process For Chemically Mechanically Polishing Substrate Materials For Electrical, Mechanical And Optical Devices
App 20130161285 - Li; Yuzhuo ; et al. | 2013-06-27 |
Chemical-mechanical Planarization Of Substrates Containing Copper, Ruthenium, And Tantalum Layers
App 20130005149 - Li; Yuzhuo ; et al. | 2013-01-03 |
Aqueous Polishing Agent And Graft Copolymers And Their Use In A Process For Polishing Patterned And Unstructured Metal Surfaces
App 20120322264 - Raman; Vijay Immanuel ; et al. | 2012-12-20 |
Abrasive Articles, Method For Their Preparation And Method Of Their Use
App 20120311935 - Kujat; Christof ; et al. | 2012-12-13 |
Process For Removing A Bulk Material Layer From A Substrate And A Chemical Mechanical Polishing Agent Suitable For This Process
App 20120235081 - Raman; Vijay Immanuel ; et al. | 2012-09-20 |
Process For Removing A Bulk Material Layer From A Substrate And A Chemical Mechanical Polishing Agent Suitable For This Process
App 20120231627 - Raman; Vijay Immanuel ; et al. | 2012-09-13 |
Chemical Mechanical Polishing (cmp) Composition Comprising Inorganic Particles And Polymer Particles
App 20120208344 - Lauter; Michael ; et al. | 2012-08-16 |
Dispersion Comprising Cerium Oxide And Silicon Dioxide
App 20120083188 - Kroell; Michael ; et al. | 2012-04-05 |
Raspberry-type Metal Oxide Nanostructures Coated With Ceo2 Nanoparticles For Chemical Mechanical Planarization (cmp)
App 20120077419 - Zhang; Zhihua ; et al. | 2012-03-29 |
Aqueous Polishing Agent Comprising Solid Polymer Particles And Two Complexing Agents And Its Use In A Process For Polishing Patterned And Unstructured Metal Surfaces
App 20120058641 - Raman; Vijay Immanuel ; et al. | 2012-03-08 |
Aqueous Metal Polishing Agent Comprising A Polymeric Abrasiv Containing Pendant Functional Groups And Its Use In A Cmp Process
App 20120058643 - Raman; Vijay Immanuel ; et al. | 2012-03-08 |
Oxidizing Particles Based Slurry For Nobel Metal Including Ruthenium Chemical Mechanical Planarization
App 20120045970 - Li; Yuzhuo ; et al. | 2012-02-23 |
Chemical Mechanical Polishing (cmp) Polishing Solution With Enhanced Performance
App 20110269312 - Li; Yuzhuo ; et al. | 2011-11-03 |
Slurry Containing Multi-oxidizer And Mixed Nano-abrasives For Tungsten Cmp
App 20110186542 - LI; Yuzhuo ; et al. | 2011-08-04 |
Controlling Passivating Film Properties Using Colloidal Particles, Polyelectrolytes, And Ionic Additives For Copper Chemical Mechanical Planarization
App 20100178768 - Li; Yuzhuo | 2010-07-15 |
METHOD AND APARATUS FOR ELECTROCHEMICAL MECHANICAL POLISHING NiP SUBSTRATES
App 20100059390 - Li; Yuzhuo | 2010-03-11 |
Chemical Mechanical Polishing Of Moisture Sensitive Surfaces And Compositions Thereof
App 20090321390 - Li; Yuzhuo | 2009-12-31 |
Slurry containing multi-oxidizer and nano-abrasives for tungsten CMP
App 20090047787 - Li; Yuzhuo ; et al. | 2009-02-19 |
Engineered non-polymeric organic particles for chemical mechanical planarization
Grant 7,419,519 - Li , et al. September 2, 2 | 2008-09-02 |
Electrolyte Formulation For Electrochemical Mechanical Planarization
App 20080142375 - Doniat; Francois ; et al. | 2008-06-19 |
Process For Reducing Dishing And Erosion During Chemical Mechanical Planarization
App 20080090500 - Hellring; Stuart D. ; et al. | 2008-04-17 |
Chemically Modified Chemical Mechanical Polishing Pad
App 20080034670 - Li; Yuzhuo ; et al. | 2008-02-14 |
Silica and silica-based slurry
Grant 7,279,119 - Hellring , et al. October 9, 2 | 2007-10-09 |
Chemically modified chemical mechanical polishing pad, process of making a modified chemical mechanical polishing pad and method of chemical mechanical polishing
App 20070037491 - Li; Yuzhuo ; et al. | 2007-02-15 |
Chemical mechanical planarization process control utilizing in-situ conditioning process
Grant 7,166,014 - Benner , et al. January 23, 2 | 2007-01-23 |
Engineered non-polymeric organic particles for chemical mechanical planarization
App 20060261306 - Li; Yuzhuo ; et al. | 2006-11-23 |
Non-polymeric organic particles for chemical mechanical planarization
Grant 7,037,351 - Li , et al. May 2, 2 | 2006-05-02 |
Chemical mechanical planarization process control utilizing in-situ conditioning process
App 20050164606 - Benner, Stephen J. ; et al. | 2005-07-28 |
Photo-chemical remediation of Cu-CMP waste
Grant 6,916,428 - Li , et al. July 12, 2 | 2005-07-12 |
Photo-chemical remediation of Cu-CMP waste
App 20050072742 - Li, Yuzhuo ; et al. | 2005-04-07 |
Non-polymeric organic particles for chemical mechanical planarization
App 20050005525 - Li, Yuzhuo ; et al. | 2005-01-13 |
Process for reducing dishing and erosion during chemical mechanical planarization
App 20040077295 - Hellring, Stuart D. ; et al. | 2004-04-22 |
Silica and silica-based slurry
App 20040067649 - Hellring, Stuart D. ; et al. | 2004-04-08 |
Method of fabricating a copper damascene structure
Grant 6,660,639 - Li , et al. December 9, 2 | 2003-12-09 |
Silica-based slurry
Grant 6,656,241 - Hellring , et al. December 2, 2 | 2003-12-02 |
Abrasive composition containing organic particles for chemical mechanical planarization
Grant 6,620,215 - Li , et al. September 16, 2 | 2003-09-16 |
Abrasive composition containing organic particles for chemical mechanical planarization
App 20030136055 - Li, Yuzhuo ; et al. | 2003-07-24 |
Method of fabricating a copper damascene structure
App 20030098434 - Li, Yuzhuo ; et al. | 2003-05-29 |
Silica and a silica-based slurry
App 20030094593 - Hellring, Stuart D. ; et al. | 2003-05-22 |
Slurry for chemical-mechanical polishing copper damascene structures
Grant 6,508,953 - Li , et al. January 21, 2 | 2003-01-21 |
Diamond slurry for chemical-mechanical planarization of semiconductor wafers
Grant 6,258,721 - Li , et al. July 10, 2 | 2001-07-10 |
Diamond slurry for chemical-mechanical planarization of semiconductor wafers
Grant 6,242,351 - Li , et al. June 5, 2 | 2001-06-05 |
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