Li, Yonggang

USPTO Trademark & Patent Filings

Li Yonggang

Trademark applications and grants for Li, Yonggang. Li, Yonggang has 5 trademark applications. The latest application filed is for "OLAZOL"

Company Profile
    Company Aliases
  • Li, Yonggang
  • yonggang li
  • Li; Yonggang - Chandler AZ
  • LI; Yonggang - Chandler AZ
  • LI; Yonggang - Nanjing CN
Entity Type INDIVIDUAL
Address 9b2501,Phase II,Mingcuiyuan, Pinghu St, No.10 Fangkeng Road, Longgang District, Shenzhen, Guangdong CHINA 518111

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Trademarks Patents
Patent Applications
Patent ApplicationDate
SUBSTRATE EMBEDDED MAGNETIC CORE INDUCTORS AND METHOD OF MAKING
20220254559 - 17/731498 Pietambaram; Srinivas Venkata Ramanuja ;   et al.
2022-08-11
CONDUCTIVE ROUTE PATTERNING FOR ELECTRONIC SUBSTRATES
20220093520 - 17/026703 Ecton; Jeremy D. ;   et al.
2022-03-24
FABRICATING AN RF FILTER ON A SEMICONDUCTOR PACKAGE USING SELECTIVE SEEDING
20210305668 - 17/344715 MARIN; Brandon C. ;   et al.
2021-09-30
LIGHT GUIDE FILM PRODUCT PROCESSING APPARATUS
20210213694 - 16/965763 LIU; Yong ;   et al.
2021-07-15
FABRICATING AN RF FILTER ON A SEMICONDUCTOR PACKAGE USING SELECTIVE SEEDING
20200373261 - 16/421989 MARIN; Brandon C. ;   et al.
2020-11-26
In-situ component fabrication of a highly efficient, high inductance air core inductor integrated into substrate packages
11,404,389 - 16/147,563 Ecton , et al. August 2, 2
2022-08-02
Substrate embedded magnetic core inductors and method of making
11,348,718 - 16/022,894 Pietambaram , et al. May 31, 2
2022-05-31
Fabricating an RF filter on a semiconductor package using selective seeding
11,081,768 - 16/421,989 Marin , et al. August 3, 2
2021-08-03
Electronic package that includes lamination layer
10,985,080 - 15/778,042 Malatkar , et al. April 20, 2
2021-04-20
Electronic device package with reduced thickness variation
10,910,327 - 16/369,681 Li , et al. February 2, 2
2021-02-02
Patent Grants & Applications

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