name:-0.0028741359710693
name:-0.001446008682251
name:-0.0013399124145508
LI; Yinglong Patent Filings

LI; Yinglong

Patent Applications and Registrations

Patent applications and USPTO patent grants for LI; Yinglong.The latest application filed is for "method, apparatus, and system for wafer grounding".

Company Profile
1.1.2
  • LI; Yinglong - San Jose CA
  • Li; Yinglong - Fremont CA
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Trademarks
Patent Activity
PatentDate
Method, Apparatus, And System For Wafer Grounding
App 20220277926 - WANG; Yixiang ;   et al.
2022-09-01
Systems and methods for horizontal wafer packaging
Grant 11,276,593 - Cherry, III , et al. March 15, 2
2022-03-15
Systems and Methods for Horizontal Wafer Packaging
App 20210028038 - Cherry III; Royal Wallace ;   et al.
2021-01-28

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