LI; Yida
Patent Applications and Registrations
Patent applications and USPTO patent grants for LI; Yida.The latest application filed is for "methods for making three-dimensional module".
- LI; Yida - ShenZhen CN
- Li; Yida - Hsinchu TW
- Li; Yida - Hsin-Chu TW
- LI; Yida - Hsinchu City TW
| Patent | Date |
|---|---|
| Methods for Making Three-Dimensional Module App 20220084961 - ZHANG; Guobiao ; et al. | 2022-03-17 |
| Multi-bit-per-cell three-dimensional resistive random-access memory (3D-RRAM) Grant 11,170,863 - Zhang , et al. November 9, 2 | 2021-11-09 |
| Multi-Bit-Per-Cell Three-Dimensional Resistive Random-Access Memory (3D-RRAM) App 20200350030 - ZHANG; Guobiao ; et al. | 2020-11-05 |
| Formation method of interconnection structure of semiconductor device Grant 10,658,234 - Hung , et al. | 2020-05-19 |
| Metal liner overhang reduction and manufacturing method thereof Grant 9,899,258 - Wu , et al. February 20, 2 | 2018-02-20 |
| Structure And Formation Method Of Interconnection Structure Of Semiconductor Device App 20180033687 - HUNG; Min-Hsiu ; et al. | 2018-02-01 |
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