Li; Xiang Chao
Patent Applications and Registrations
Patent applications and USPTO patent grants for Li; Xiang Chao.The latest application filed is for "wire bonder including a transducer, a bond head, and a mounting apparatus".
- Li; Xiang Chao - Singapore SG
| Patent | Date |
|---|---|
| Wire bonder including a transducer, a bond head, and a mounting apparatus Grant 8,919,631 - Wong , et al. December 30, 2 | 2014-12-30 |
| Wire Bonder Including A Transducer, A Bond Head, And A Mounting Apparatus App 20130240605 - WONG; Yam Mo ; et al. | 2013-09-19 |
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