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Li; Xi Lin Patent Filings

Li; Xi Lin

Patent Applications and Registrations

Patent applications and USPTO patent grants for Li; Xi Lin.The latest application filed is for "copper wire bond on gold bump on semiconductor die bond pad".

Company Profile
3.4.5
  • Li; Xi Lin - Chengdu CN
  • Li; Xi-Lin - San Jose CA
  • LI; Xi-Lin - Sunnyvale CA
  • Li; Xi-Lin - Cupertino CA
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Copper Wire Bond On Gold Bump On Semiconductor Die Bond Pad
App 20210313291 - Zhang; Lin ;   et al.
2021-10-07
Ball bond attachment for a semiconductor die
Grant 10,692,835 - Zhong , et al.
2020-06-23
Ball Bond Attachment For A Semiconductor Die
App 20190378814 - Zhong; Han ;   et al.
2019-12-12
Wire Ball Bonding In Semiconductor Devices
App 20190221537 - ZHONG; Han ;   et al.
2019-07-18
Wire ball bonding in semiconductor devices
Grant 10,340,246 - Zhong , et al.
2019-07-02
Speech enhancement for target speakers
Grant 9,741,360 - Li , et al. August 22, 2
2017-08-22
Method For Calibrating Performance Of Small Array Microphones
App 20140363001 - HUANG; Yen-Son Paul ;   et al.
2014-12-11
Audio processing apparatus and method
Grant 8,275,148 - Li , et al. September 25, 2
2012-09-25
Audio Processing Apparatus And Method
App 20110026730 - Li; Xi-Lin ;   et al.
2011-02-03

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