Li; Wu Hu
Patent Applications and Registrations
Patent applications and USPTO patent grants for Li; Wu Hu.The latest application filed is for "power module with metal substrate".
- Li; Wu Hu - Singapore SG
| Patent | Date |
|---|---|
| Power Module With Metal Substrate App 20220310465 - Li; Wu Hu ; et al. | 2022-09-29 |
| Soldering a conductor to an aluminum metallization Grant 11,450,642 - Riedl , et al. September 20, 2 | 2022-09-20 |
| Power module with metal substrate Grant 11,404,336 - Li , et al. August 2, 2 | 2022-08-02 |
| Power Module with Metal Substrate App 20210407873 - Li; Wu Hu ; et al. | 2021-12-30 |
| Soldering A Conductor To An Aluminum Metallization App 20210118843 - Riedl; Edmund ; et al. | 2021-04-22 |
| Soldering a conductor to an aluminum metallization Grant 10,896,893 - Riedl , et al. January 19, 2 | 2021-01-19 |
| Soldering a conductor to an aluminum metallization Grant 10,892,247 - Riedl , et al. January 12, 2 | 2021-01-12 |
| Method for Providing Coated Leadframes or for Measuring an Adhesion Force of an Encapsulant on a Leadframe App 20200381314 - Li; Wu Hu ; et al. | 2020-12-03 |
| Soldering A Conductor To An Aluminum Metallization App 20200243480 - Riedl; Edmund ; et al. | 2020-07-30 |
| Soldering A Conductor To An Aluminum Metallization App 20200219841 - Riedl; Edmund ; et al. | 2020-07-09 |
| Soldering a conductor to an aluminum metallization Grant 10,615,145 - Riedl , et al. | 2020-04-07 |
| Connection member with bulk body and electrically and thermally conductive coating Grant 10,366,946 - Li , et al. July 30, 2 | 2019-07-30 |
| Connection member with bulk body and electrically and thermally conductive coating App 20190131218 - LI; Wu Hu ; et al. | 2019-05-02 |
| Soldering A Conductor To An Aluminum Metallization App 20190035764 - Riedl; Edmund ; et al. | 2019-01-31 |
| Electronic component employing a layered frame Grant 8,703,544 - Li , et al. April 22, 2 | 2014-04-22 |
| Electronic Component App 20120156832 - Li; Wu Hu ; et al. | 2012-06-21 |
| Electronic component with layered frame Grant 8,125,060 - Li , et al. February 28, 2 | 2012-02-28 |
| Leadframe, semiconductor package and support lead for bonding with groundwires Grant 7,875,968 - Li , et al. January 25, 2 | 2011-01-25 |
| Electronic component App 20080135995 - Li; Wu Hu ; et al. | 2008-06-12 |
| Leadframe and Semiconductor Package App 20080128741 - Li; Wu Hu ; et al. | 2008-06-05 |
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