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Patent applications and USPTO patent grants for Li; Tsung-Ming.The latest application filed is for "method for fabricating electronic package having a protruding barrier frame".
Patent | Date |
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Method for fabricating electronic package having a protruding barrier frame Grant 10,396,040 - Jian , et al. A | 2019-08-27 |
Method For Fabricating Electronic Package Having A Protruding Barrier Frame App 20180261552 - Jian; Yue-Ying ;   et al. | 2018-09-13 |
Electronic package having a protruding barrier frame Grant 9,997,469 - Jian , et al. June 12, 2 | 2018-06-12 |
Electronic Package And Method For Fabricating The Same App 20180040568 - Jian; Yue-Ying ;   et al. | 2018-02-08 |
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